Strain-Inducing Layer Structure for 2D Material Mobility

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Solution Overview

Problem

Current electronic devices using two-dimensional materials as channels face limitations in channel mobility, which affects their performance due to variations in material properties and short channel effects.

Innovation Solution

A layer structure is developed with a first layer and a second layer that overlap, where one layer applies strain to the other, and a buffer layer can be included to enhance carrier mobility by controlling strain-induced changes in the band gap, thereby increasing the mobility of carriers.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If two-dimensional materials are used as channels, then short channel effect is reduced and channel scaling is advantageous, but channel mobility is limited due to material property variations

Engineering Contradiction:

Improveshort channel effect reductionVSAvoidchannel mobility

Core Design Contradiction:

ReliabilityVSSpeed

Solution Approach 1:

The patent applies strain engineering to change the physical parameters of the channel material. By introducing mechanical strain through a strain-inducing layer, the band structure of the two-dimensional material is modified, directly altering carrier mobility while preserving the short channel effect benefits of the 2D channel structure.

Inventive Principle:

Principle #35Parameter changes

Solution Approach 2:

The patent creates a composite structure combining the two-dimensional channel material with a strain-inducing layer. This composite approach allows the channel material to maintain its excellent short channel characteristics while the strain-inducing layer provides the necessary mechanical stress to enhance carrier mobility, effectively combining benefits from different material systems.

Inventive Principle:

Principle #40Composite materials

2Speed

If strain is applied to increase carrier mobility, then electron and hole mobility improve, but device structure and manufacturing process become more complex

Engineering Contradiction:

Improvecarrier mobilityVSAvoidlayer structure complexity

Core Design Contradiction:

SpeedVSDevice complexity

Solution Approach 1:

The patent separates the strain induction function from the channel function by introducing a distinct strain-inducing layer. This segmentation allows independent optimization of the channel material for short channel performance and the strain-inducing layer for mobility enhancement, simplifying the overall design despite the additional layer.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The strain-inducing layer acts as an intermediary element between the substrate and the channel material. It provides the necessary mechanical stress to enhance carrier mobility without requiring direct modification of the channel material itself, thereby simplifying the manufacturing process compared to alternative approaches that would require complex in-situ strain application methods.

Inventive Principle:

Principle #24Intermediary (Mediator)

3Productivity

If strain-inducing layer is added to enhance carrier mobility, then on-current increases, but manufacturing precision requirements increase

Engineering Contradiction:

Improveon-currentVSAvoidlayer thickness control

Core Design Contradiction:

ProductivityVSManufacturing precision

Solution Approach 1:

The patent utilizes the strain-inducing layer's thickness as a controllable parameter to adjust the magnitude of applied strain. By precisely controlling the thickness of this layer, manufacturers can tune the carrier mobility enhancement and on-current levels while maintaining compatibility with existing thin-film fabrication techniques, thereby managing manufacturing precision requirements.

Inventive Principle:

Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach effectively increases carrier mobility, leading to improved performance in electronic devices by optimizing strain application during manufacturing, enhancing both electron and hole mobility based on the type of channel material used.

Implementation Method 1

performing a cooling operation that includes cooling the first layer and the second layer to the room temperature. One layer, among the first layer and the second layer, may include a strain-inducing layer configured to intentionally induce a strain in an other layer in the cooling operation.

Methodology Applied

Scientific EffectThermal contraction: Thermal Contraction

Data Source

PatentUS20230036321A1Layer structures including configuration increasing operation characteristics, methods of manufacturing the same, electronic devices including layer structures, and electronic apparatuses including electronic devices

Publication Date: 2023.02.02 SAMSUNG ELECTRONICS CO LTD

AI summary

Provided are a layer structure including a configuration capable of increasing the operation characteristics of a device including the layer structure, a method of manufacturing the layer structure, an electronic device including the layer structure, and an electronic apparatus including the electronic device. The layer structure includes a first layer and a second layer on one surface of the first layer and facing the first layer. The first layer and the second layer overlap each other. One layer of the first layer and the second layer has a trace of applied strain, and an other layer of the first layer and the second layer is a strain-inducing layer that applies a strain to the one layer.