Stress Detection Portion for Thin Film Encapsulation
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Solution Overview
Problem
Display panels are susceptible to defects such as black spots and pinholes due to oxygen and water vapor penetration, which can reduce their service life, and existing encapsulation methods lack effective stress detection and reinforcement.
Innovation Solution
A display panel design incorporating a stress detection portion that extends from outside the thin film encapsulation layer to overlap and contact with it, enhancing stress detection accuracy and reinforcing the encapsulation structure by increasing the contact area between the encapsulation layer and the array layer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a thin film encapsulation layer is used to prevent moisture and oxygen penetration, then the service life of the display panel is improved, but the encapsulation layer is susceptible to stress and potential cracks that reduce its reliability
Solution Approach 1:
The stress detection portion is integrated into the encapsulation structure before the display panel is put into service. This detection component is positioned to overlap with and contact the encapsulation layer, enabling early detection of stress and potential cracks before they lead to failure, thus maintaining high reliability while addressing the vulnerability to stress
Solution Approach 2:
The stress detection portion provides real-time feedback on the stress state of the encapsulation layer. By monitoring stress changes and potential cracks through this detection mechanism, the system can identify degradation early, allowing for maintenance or replacement before complete failure occurs, thereby resolving the contradiction between improving reliability and addressing stress vulnerabilities
2Measurement precision
If the stress detection portion extends from outside the encapsulation layer to overlap and contact with it, then stress detection accuracy is improved, but the device structure becomes more complex
Solution Approach 1:
The stress detection portion is merged with the encapsulation structure by having it extend from outside the encapsulation layer to overlap and contact with it. This integration allows the detection function to be combined with the existing encapsulation architecture, improving stress detection accuracy while minimizing the increase in overall device complexity through unified design
Data Source
AI summary
The present disclosure provides a display panel and a display apparatus. The display panel includes a substrate, an array layer located on the substrate, a display layer located on a side of the array layer facing away from the substrate and comprising light-emitting components, a thin film encapsulation layer located on a side of the display layer facing away from the array layer; and at least one stress detection portion extending to a region overlapping with and in contact with the thin film encapsulation layer from a region outside the thin film encapsulation layer and not overlapping with the thin film encapsulation layer. Through the stress detection section, the strain of the edge portion of the thin film encapsulation layer can be accurately evaluated. With a pinned structure, the encapsulation structure can be strengthened and the encapsulation reliability can be enhanced.