Stress Directing Material in IC Encapsulant

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Solution Overview

Problem

Traditional encapsulation processes for integrated circuits do not allow for the formation of stress directing structures within the encapsulant material, leading to potential detuning of sensitive circuits due to thermal and mechanical stress, and lack the ability to integrate additional package functions without increasing cost and complexity.

Innovation Solution

The integration of stress directing structures within the encapsulant material using additive manufacturing processes, which enables the deposition of patterned materials to isolate or focus mechanical and thermal stress on specific regions of the semiconductor die, and allows for the creation of heat sink capacity and mechanical isolation during the encapsulation process.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If traditional encapsulation processes are used, then the package provides protection and mechanical strength, but stress directing structures cannot be formed within the encapsulant material

Engineering Contradiction:

Improveprotection and mechanical strengthVSAvoidformation of stress directing structures

Core Design Contradiction:

ReliabilityVSEase of manufacture

Solution Approach 1:

The patent combines encapsulant material with stress directing material to form a composite structure. The stress directing material is integrated within the encapsulant material to create a composite package structure that provides both protection and stress directing functionality, resolving the contradiction between maintaining protective encapsulation and enabling stress directing structures.

Inventive Principle:

Principle #40Composite materials

2Reliability

If stress directing structures are integrated into the encapsulant material, then stress control on the die is improved, but the device complexity increases

Engineering Contradiction:

Improvestress control on dieVSAvoidpackage structure complexity

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The patent merges the encapsulation function with the stress directing function into a single integrated structure. The stress directing structures are combined with the encapsulant material, eliminating the need for separate stress control components and reducing overall device complexity while maintaining stress control benefits.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The encapsulant material is given multiple functions: it provides both mechanical protection/encapsulation and stress directing control. This multi-functionality reduces the need for additional separate components, thereby managing device complexity while achieving improved stress control.

Inventive Principle:

Principle #6Universality (Multi-functionality)

3Adaptability or versatility

If additional package functions are integrated into the encapsulation process, then functionality is enhanced, but manufacturing cost and complexity increase

Engineering Contradiction:

Improvepackage functionalityVSAvoidmanufacturing cost and complexity

Core Design Contradiction:

Adaptability or versatilityVSEase of manufacture

Solution Approach 1:

The patent combines multiple package functions (encapsulation, stress directing, and heat sinking) into a single integrated manufacturing process. The stress directing structures are formed within the encapsulant material during the same encapsulation process, eliminating the need for separate manufacturing steps and reducing overall manufacturing cost and complexity.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The encapsulation process is designed to perform multiple functions simultaneously: providing mechanical protection, directing stress, and creating heat sink capacity. This multi-functional approach enhances package versatility while managing manufacturing cost and complexity by consolidating processes.

Inventive Principle:

Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach effectively minimizes or amplifies stress on sensitive areas of the die as needed, enhancing the functionality and reliability of integrated circuit packages while maintaining cost efficiency by integrating mechanical and acoustic functions directly into the encapsulation material.

Implementation Method 1

enables the deposition of patterned materials to isolate or focus mechanical and thermal stress on specific regions of the semiconductor die

Methodology Applied

Scientific EffectStress distribution:

Implementation Method 2

using additive manufacturing processes, which enables the deposition of patterned materials

Methodology Applied

Scientific EffectAdditive manufacturing deposition: Deposition (physical)

Implementation Method 3

allows for the creation of heat sink capacity and mechanical isolation during the encapsulation process

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS10622270B2Integrated circuit package with stress directing material

Publication Date: 2020.04.14 TEXAS INSTRUMENTS INC

AI summary

An encapsulated integrated circuit that includes an integrated circuit (IC) die and an encapsulation material encapsulating the IC die. A first portion of the encapsulation material is solid and a second portion of the encapsulation material includes spaces filled with a second material.