Stretchable Circuit Board Adhesive Layer Design
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Solution Overview
Problem
Existing stretchable circuit boards face manufacturing inefficiencies due to the need for hot pressing, which increases the risk of wire disconnection and reduces manufacturing speed, especially when using stretchable auxiliary materials to manage the transition between stretchable and non-stretchable base materials.
Innovation Solution
A stretchable circuit board design featuring a stretchable base material with a film base material of lower stretchability, integrated stretchable wiring lines, and an adhesive layer on both overlapping and non-overlapping regions, eliminating the need for hot pressing by ensuring secure attachment and reducing wire disconnection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a stretchable auxiliary material is provided at the boundary between stretchable base material and hard base material to prevent wire disconnection, then wire disconnection is prevented, but manufacturing complexity and process time increase due to the need for hot pressing
Solution Approach 1:
The patent removes the stretchable auxiliary material from the structure, eliminating the need for hot pressing operations while maintaining wire connection reliability through the adhesive layer design on the hard base material
Solution Approach 2:
The patent replaces the mechanical hot pressing process with a chemical adhesive bonding process, where the adhesive layer chemically bonds the hard base material to the stretchable base material, eliminating the need for complex hot pressing equipment and operations
2Strength
If hot pressing is used to attach the hard base material to the stretchable base material, then secure attachment is achieved, but manufacturing speed decreases and wire disconnection risk increases
Solution Approach 1:
The patent replaces the mechanical hot pressing process with chemical adhesive bonding, enabling faster manufacturing while maintaining attachment strength through the optimized adhesive layer that bonds both stretchable and non-stretchable regions
Solution Approach 2:
The patent changes the bonding mechanism from thermal-mechanical (hot pressing) to chemical (adhesive bonding), fundamentally altering the process parameters to achieve both strong attachment and high manufacturing speed without wire disconnection risks
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances manufacturing efficiency by eliminating the hot pressing step and reducing wire disconnection, allowing for a more reliable and faster production process of stretchable circuit boards.
Implementation Method 1
an adhesive layer formed on one surface side or the other surface side of the stretchable base material. The adhesive layer is formed on both of an overlapping region where the stretchable base material overlaps with the film base material and a non-overlapping region where the stretchable base material does not overlap with the film base material
Data Source
AI summary
Provided is a stretchable circuit board including: a stretchable base material having stretchability; a film base material overlapping with part of a one-surface-side surface of the stretchable base material and having lower stretchability than that of the stretchable base material; a stretchable wiring line formed on the one-surface-side surface of the stretchable base material; and an adhesive layer formed on one surface side or the other surface side of the stretchable base material. The adhesive layer is formed on both of an overlapping region where the stretchable base material overlaps with the film base material and a non-overlapping region where the stretchable base material does not overlap with the film base material.