Stretchable Electrical Connection for Flexible Light-Emitting Devices
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Solution Overview
Problem
The existing manufacturing processes for light-emitting devices are limited by the size and shape of carriers, which restrict the arrangement and connection of light-emitting diodes, leading to complexity in matching various product specifications and electrical circuit layouts.
Innovation Solution
A light-emitting device with a semiconductor light-emitting element, a transparent layer, and a stretchable electrical connection structure that allows for flexible connection and arrangement of light-emitting elements, enabling easy deformation to match different surfaces and allowing for independent control of light emission from each element.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If light-emitting diodes are arranged on a carrier with fixed size and shape, then the electrical circuit layout and product specifications are matched, but the manufacturing complexity increases and adaptability to different product requirements decreases
Solution Approach 1:
The patent divides the light-emitting device into separate modules: light-emitting diodes are arranged on a sub-mount rather than a fixed carrier, and the electrical connection structure is separated into distinct conductive paths. This segmentation allows independent optimization of each component for different product specifications without increasing overall manufacturing complexity
Solution Approach 2:
The sub-mount design with flexible electrical connection structures serves multiple functions: it provides mechanical support for light-emitting diodes, enables electrical connectivity, and allows adaptation to various product configurations. The same sub-mount structure can accommodate different numbers and arrangements of light-emitting diodes, making it universally applicable to different product specifications
2Power
If multiple light-emitting diodes are integrated into one structure, then the light-emitting capability is enhanced, but the arrangement flexibility and heat dissipation performance are limited
Solution Approach 1:
Each light-emitting diode is mounted on the sub-mount with its own electrical connection path, creating spatial separation between heat sources. This segmentation prevents heat accumulation and improves thermal management while maintaining enhanced light-emitting capability through the integrated array of multiple diodes
Solution Approach 2:
The electrical connection structure extends in multiple dimensions with conductive paths that connect light-emitting diodes arranged in various configurations. This multi-dimensional arrangement optimizes both light-emitting output and heat dissipation by distributing thermal load across different spatial dimensions
3Ease of manufacture
If the carrier size and shape are fixed, then the manufacturing process is simplified, but the ability to match various product requirements is reduced
Solution Approach 1:
The sub-mount is designed as a universal platform that can accommodate different numbers, types, and arrangements of light-emitting diodes. The flexible electrical connection structure adapts to various configurations without requiring different carrier designs, maintaining manufacturing simplicity while achieving versatility across product specifications
Solution Approach 2:
The electrical connection structure incorporates flexible conductive paths that can be configured dynamically to match different product requirements. This dynamic adaptability allows the same manufacturing process to produce varied product specifications by simply reconfiguring the connection layout rather than changing the entire carrier design
Data Source
AI summary
This disclosure discloses a light-emitting device includes a semiconductor light-emitting element having a first electrode and a second electrode, a transparent layer covering the semiconductor light-emitting element, a stretchable electrical connection structure and an electrical contact portion. The stretchable electrical connection structure is formed in the transparent layer and electrically connects the first electrode, and the electrical contact portion is formed on the transparent layer and electrically connects the second electrode.