Stretchable Interconnect for Freeform Surfaces
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Solution Overview
Problem
Existing electronic systems applied to freeform surfaces, such as textiles, often compromise the wearing comfort and are limited to curving in only one spatial direction, restricting their application to rigid or stretchable surfaces.
Innovation Solution
A method involving a stretchable substrate with a fan-out contact structure and encapsulation using stretchable materials, allowing for the application of electronic components that maintain the surface's deformability and flexibility, enabling multidimensional curvature without significantly reducing comfort or reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If electronic systems are applied to freeform surfaces using conventional methods, then electronic components can be mounted on the surface, but the wearing comfort of the textile is significantly reduced and the system can only curve in one spatial direction
Solution Approach 1:
The patent employs a thin-film substrate with a fan-out contact structure that allows the electronic system to conform to surfaces curved in multiple spatial directions. The substrate's thin-film nature enables it to bend and stretch while maintaining electrical connectivity, resolving the contradiction between curving capability and wearing comfort by allowing multidirectional conformability without rigid structural constraints
Solution Approach 2:
The contact structure is designed with dynamic fan-out geometry that adapts to surface curvature changes. The conductive traces are arranged in a fan pattern that can expand and contract as the textile stretches or bends, enabling the electronic system to maintain functionality across varying deformation states while preserving textile flexibility and wearing comfort
2Reliability
If a rigid contact structure is used to ensure reliable electrical connections, then connection reliability is improved, but the electronic system cannot be applied to multidimensional freeform surfaces
Solution Approach 1:
The contact structure utilizes curved fan-out trace patterns instead of straight rigid connections. The curved geometry allows the traces to follow the contours of multidimensional surfaces while maintaining continuous electrical pathways, enabling reliable connections on complex freeform surfaces without requiring rigid structural elements
Solution Approach 2:
The fan-out contact structure employs nested concentric circular trace patterns that can accommodate surface deformation. The nested geometry allows inner traces to follow the curvature while outer traces provide structural support, maintaining connection reliability across varying surface geometries through a hierarchical nested arrangement
3Manufacturing precision
If the contact structure uses fine-pitch traces for precise electrical connections, then connection precision is improved, but the manufacturing complexity and cost increase
Solution Approach 1:
The fan-out contact structure serves multiple functions simultaneously: it provides precise electrical connections, accommodates surface curvature, and simplifies manufacturing through standard PCB fabrication techniques. The universal fan-out geometry can be implemented using conventional printing and etching processes, achieving precise trace routing without complex manufacturing steps
Data Source
AI summary
The invention relates to a method for generating an electronic system for application to freeform surfaces, a method for producing freeform surfaces having an electronic system, and an electronic system and a combination of a freeform surface having at least one such system. According to the invention, an elastic interconnect device having an elastic substrate and an elastic, fanned-out contact structure with contact surfaces comprised of conductor lines is generated first. Then, electronic components are mounted on the interconnect device. Finally, the interconnect device is encapsulated. If a freeform surface with an electronic system is to be generated, the electronic system produced in this way is then mounted on the previously provided freeform surface.