Stretchable Mounting Substrate with Embedded Wiring to Reduce Intersections

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Solution Overview

Problem

Existing stretchable substrates face challenges in maintaining flexibility and reducing manufacturing costs due to increased complexity and wiring intersections, which complicate circuits and increase resistance.

Innovation Solution

A stretchable mounting substrate design that includes a multilayer substrate with internal wirings connecting electrode pairs, reducing wiring intersections and using modules to minimize direct electronic component mounting, thereby optimizing flexibility and cost.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Quantity of substance

If the number of electronic components mounted on the stretchable base material is increased, then the mounting density is improved, but the flexibility of the stretchable substrate is lost

Engineering Contradiction:

Improvenumber of electronic componentsVSAvoidflexibility

Core Design Contradiction:

Quantity of substanceVSStability of the object's composition

Solution Approach 1:

The patent divides the stretchable substrate into multiple independent islands distributed across the base material. Each island can be independently mounted with electronic components, allowing high mounting density while maintaining the overall flexibility of the substrate. The islands act as discrete units that do not constrain the stretching motion of the base material.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The patent transitions from mounting all electronic components directly on the 2D surface of the stretchable base material to using 3D vertical structures (islands with multiple layers). This dimensional change allows components to be stacked vertically, increasing mounting density without occupying additional horizontal space that would reduce flexibility.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

2Quantity of substance

If the number of electronic components mounted on the stretchable base material is increased, then the mounting density is improved, but the manufacturing cost increases

Engineering Contradiction:

Improvenumber of electronic componentsVSAvoidmanufacturing cost

Core Design Contradiction:

Quantity of substanceVSEase of manufacture

Solution Approach 1:

The patent combines multiple electronic components and their associated wiring into integrated island structures. By merging components that would otherwise require separate mounting processes and individual wiring routes, the patent reduces the overall manufacturing complexity and cost while achieving high mounting density.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The island structures serve multiple functions simultaneously: they provide mechanical support for multiple electronic components, act as routing pathways for wiring, and function as insulation barriers. This multi-functionality reduces the need for additional manufacturing steps and materials, thereby reducing manufacturing cost.

Inventive Principle:

Principle #6Universality (Multi-functionality)

3Reliability

If stretchable wirings are routed around electronic components, then connectivity is achieved, but the wirings intersect and require insulating layers that reduce flexibility

Engineering Contradiction:

Improveelectrical connectivityVSAvoidflexibility

Core Design Contradiction:

ReliabilityVSStability of the object's composition

Solution Approach 1:

The patent nests wiring pathways within the three-dimensional structure of the islands. Wiring routes are embedded inside the island volumes rather than being routed on the surface, allowing multiple wiring layers to be nested within each other. This eliminates intersections between wirings from different islands while maintaining electrical connectivity, and avoids the need for additional insulating layers that would reduce flexibility.

Inventive Principle:

Principle #7Nested doll (Nesting)

4Reliability

If stretchable wirings are routed around electronic components, then connectivity is achieved, but the wiring length increases and resistance increases

Engineering Contradiction:

Improveelectrical connectivityVSAvoidwiring resistance

Core Design Contradiction:

ReliabilityVSLoss of energy

Solution Approach 1:

The patent extracts the wiring function from the external routing around components and integrates it into the internal structure of the islands. By taking out the wiring paths from the peripheral routing and embedding them within the island volumes, the patent significantly shortens the wiring length and reduces resistance while maintaining connectivity.

Inventive Principle:

Principle #2Taking out (Extraction)

Data Source

PatentUS12363823B2Stretchable mounting substrate

Publication Date: 2025.07.15 MURATA MFG CO LTD

AI summary

A stretchable mounting substrate that includes: a stretchable wiring substrate, the stretchable wiring substrate including a stretchable base material and a stretchable wiring arranged on the stretchable base material; and a module on a surface of the stretchable wiring substrate, the module including a multilayer substrate, a plurality of electronic components on a principal surface of the multilayer substrate, a plurality of first electrodes and a plurality of second electrodes, and internal wirings inside the multilayer substrate. The module has a first electrode arrangement region where the plurality of first electrodes are arranged and a second electrode arrangement region where the plurality of second electrodes are arranged, and includes a node electrode pair, and the internal wiring of the node electrode pair and the stretchable wiring on the stretchable base material intersect each other in plan view of the stretchable wiring substrate.