Stretchable Stamp Transfer for High-Productivity Micro-LED Assembly
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Solution Overview
Problem
The existing methods for manufacturing micro-LED displays are hindered by low mass productivity and high process costs due to the repetitive and labor-intensive process of transferring individual light-emitting elements to a display substrate.
Innovation Solution
A method utilizing a stretchable stamp made of elastomer with a Young's modulus of 10 Pa to 10 MPa, capable of picking up and spacing LED chips at a first interval and transferring them to a target substrate at a second interval, up to 10 times greater, allowing for improved arrangement flexibility and productivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If individual LED chips are transferred one by one to the display substrate, then the transfer precision can be maintained, but the mass productivity decreases and process cost increases
Solution Approach 1:
Multiple LED chips are picked up simultaneously by a single stamp structure, merging multiple individual transfer operations into one collective transfer action. This maintains precision through the stamp's structured design while dramatically improving productivity by transferring multiple chips in a single operation.
Solution Approach 2:
The stamp is divided into multiple pick-up pillars arranged in specific patterns, with each pillar capable of picking up individual LED chips. This segmentation allows precise positioning of each chip while enabling simultaneous handling of multiple chips, resolving the contradiction between precision and productivity.
2Ease of manufacture
If LED chips are arranged at fixed intervals on the wafer, then the manufacturing process is simplified, but the arrangement flexibility and diversity of the display decreases
Solution Approach 1:
The stamp structure allows dynamic adjustment of chip spacing through stretching in different directions. The pick-up pillars can be spaced at different intervals by stretching the stamp, enabling flexible arrangement patterns (such as pixel pens) while maintaining the simplicity of the manufacturing process. This dynamic adaptability resolves the contradiction between manufacturing simplicity and arrangement flexibility.
3Manufacturing precision
If the transfer process is repeated for each LED chip, then the transfer accuracy can be ensured, but the production time and process cost increase
Solution Approach 1:
Multiple LED chips are transferred simultaneously in a single operation using a multi-pillar stamp structure, merging multiple sequential transfer operations into one parallel operation. This maintains transfer accuracy through precise pillar positioning while dramatically reducing production time by eliminating repeated individual transfer cycles.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances the freedom and diversity of LED display arrangement, significantly reducing production costs and time by enabling the simultaneous transfer of multiple LED chips, thereby improving mass productivity.
Implementation Method 1
a body; and a plurality of pick-up pillars arranged in a predetermined pattern on one surface of the body to transfer the LED chip, wherein the body comprises an elastomer that can be stretched in more than one (uniaxial) direction
Data Source
AI summary
A manufacturing method of an LED display is disclosed. The method includes picking up a plurality of LED chips spaced apart at a first interval with a stretchable stamp, spacing apart the plurality of LED chips at a second interval by stretching the stretchable stamp, and transferring the plurality of LED chips to a target substrate.