Stretchable Substrate Groove Layout for Crack-Resistant Electronics
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Solution Overview
Problem
Stretchable electronic devices are prone to cracking or damage when deformed, affecting their lifespan due to substrate deformation.
Innovation Solution
The electronic device incorporates a substrate with a first insulating structure featuring grooves and protruding portions to reduce crack propagation, and a conductive wire design that avoids crossing these grooves, enhancing structural integrity and reducing moisture and oxygen exposure.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If the substrate is made stretchable to increase application versatility, then the device can be attached to curved surfaces and worn on skin, but the substrate may be cracked or damaged when deformed
Solution Approach 1:
The substrate is divided into multiple main structures (first main structure, second main structure, etc.) that are separated by spaces and connected by connecting structures. This segmentation allows each main structure to deform independently during stretching, preventing crack propagation across the entire substrate while maintaining overall structural integrity and enabling stretchable applications.
2Reliability
If the substrate is designed with connecting structures to maintain integrity during deformation, then substrate damage is reduced, but the device complexity increases
Solution Approach 1:
The connecting structures are designed to be flexible and deformable, allowing them to dynamically adapt their shape and configuration during substrate deformation. This dynamic design enables the connecting structures to accommodate stretching and bending movements while maintaining structural integrity, without requiring overly complex rigid support systems.
3Reliability
If the first insulating structure is disposed close to the first edge of the first main structure to block crack propagation, then reliability is improved, but moisture and oxygen exposure increases
Solution Approach 1:
The first insulating structure serves as an intermediary element positioned between the first semiconductor and the first main structure. It includes a first groove that blocks crack propagation from the substrate edge toward the semiconductor, while simultaneously providing insulation and protection. This intermediary structure addresses both crack resistance and environmental protection needs.
4Reliability
If the first groove of the first insulating structure is disposed between the first edge and the first electronic element to block cracks, then crack propagation is prevented, but the device complexity increases
Solution Approach 1:
The first insulating structure is designed with localized features including a first groove positioned specifically between the first edge of the first main structure and the first electronic element. This localized groove provides crack blocking functionality precisely where needed at the vulnerable edge region, without requiring complex structures throughout the entire device, thus maintaining simplicity while improving reliability.
Data Source
AI summary
An electronic device includes a substrate, a circuit layer, a first electronic element and a first insulating structure. The substrate includes a first main structure, a second main structure adjacent to the first main structure, a first connecting structure connecting the first main structure and the second main structure, and a first space disposed between the first main structure and the second main structure, wherein a first edge of the first main structure is overlapped with a part of a boundary of the first space. The circuit layer has a first semiconductor. The first electronic element is electrically connected to the first semiconductor. The first insulating structure includes a first groove. In a top view, at least a part of the first groove of the first insulating structure is disposed between the first edge of the first main structure and the first electronic element.