Structured Carrier Anchoring for Optoelectronic Chip Adhesion
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Solution Overview
Problem
Conventional optoelectronic components face inadequate mechanical stability due to poor adhesion between semiconductor chips and casting compounds, leading to potential displacement and failure of the device.
Innovation Solution
The optoelectronic semiconductor chip features a structured carrier with a side flank that includes singulating traces, barrier grooves, and indentations, which increases the surface area and enhances mechanical stability by forming an anchoring structure for the casting compound, preventing displacement and improving adhesion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a conventional semiconductor chip with a flat carrier is used, then the manufacturing process is simple, but the mechanical stability and adhesion between the semiconductor chip and casting compound are insufficient
Solution Approach 1:
The patent transitions from a two-dimensional flat carrier surface to a three-dimensional structured carrier with side flanks, indentations, and protrusions. This dimensional change increases the surface area and creates mechanical interlocking features that significantly improve adhesion between the carrier and casting compound, directly resolving the contradiction between simplicity and mechanical stability.
Solution Approach 2:
The carrier surface is segmented into multiple functional regions including side flanks, indentations, and protrusions. This segmentation creates distinct anchoring zones that enhance mechanical interlocking with the casting compound while maintaining a relatively simple overall carrier structure, thus improving reliability without excessive complexity.
2Area of stationary object
If the carrier surface area is increased through structuring, then the adhesion and mechanical stability improve, but the manufacturing complexity increases
Solution Approach 1:
The carrier is pre-structured with side flanks, indentations, and protrusions before the casting compound is applied. This preliminary structuring creates ready-made anchoring features that simplify the subsequent casting process, as the compound naturally flows into and locks onto the pre-formed structures, reducing overall manufacturing complexity despite the increased surface area.
Data Source
AI summary
The invention relates to an optoelectronic semiconductor chip (10) comprising a carrier (2) and a semiconductor body (1) having an active layer (13) provided for generating electromagnetic radiation. Said carrier (2) has a first main surface (2A) facing the semiconductor body, a second main surface (2B) facing away from the semiconductor body, and a sidewall (2C) arranged between the first main surface and the second main surface. The carrier (2) has a structured region (21, 22, 23, 2C) for enlarging the total surface area of the sidewall, wherein the structured region has singulation traces. The invention also relates to an optoelectronic component (100) comprising such a semiconductor chip and a method for producing a plurality of such semiconductor chips are specified.