Structured Semiconductor Chip for Wider Light Outcoupling
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Solution Overview
Problem
Radiation-emitting semiconductor chips face low radiation outcoupling efficiency due to total internal reflection, particularly in chips with planar light-emitting surfaces, leading to limited angular ranges for electromagnetic radiation emission.
Innovation Solution
The semiconductor chip design features a structured first doped region with a non-planar shape, such as trapezoidal or hemispherical, where the active region covers both side and top surfaces, reducing the likelihood of total reflection by emitting radiation perpendicular to the chip's surface, thereby increasing the angular range of emission.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a planar light-emitting surface is used in radiation-emitting semiconductor chips, then the manufacturing process is simple, but the radiation outcoupling efficiency is low due to total internal reflection
Solution Approach 1:
The patent applies curvature by replacing the planar light-emitting surface with a dome-shaped or lens-shaped transparent encapsulant that covers the active region. This curved surface structure changes the angle of incidence for emitted photons, allowing them to escape the semiconductor chip more effectively by reducing total internal reflection, thereby improving radiation outcoupling efficiency while maintaining manufacturing feasibility through established encapsulation processes
2Device complexity
If a planar light-emitting surface is used, then the device structure is simple, but the angular range of electromagnetic radiation emission is limited
Solution Approach 1:
The dome-shaped or lens-shaped transparent encapsulant creates a curved radiation outcoupling surface that expands the angular range of emitted electromagnetic radiation. The curvature allows photons to exit at wider angles relative to the chip surface, increasing the立体 angle of emission and improving adaptability for various application scenarios while adding only moderate structural complexity
Solution Approach 2:
The patent transitions from a two-dimensional planar surface to a three-dimensional curved surface by forming a dome-shaped or lens-shaped encapsulant. This dimensional change enables radiation to couple out in multiple angular directions simultaneously, expanding the emission pattern from a narrow cone to a broader spherical distribution, thereby increasing the angular range without proportionally increasing device complexity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances radiation outcoupling efficiency by allowing a larger amount of electromagnetic radiation to be emitted perpendicularly, reducing total reflection and non-radiative recombination, and increasing the angular range of emission.
Implementation Method 1
an active region, which is intended to generate electromagnetic radiation
Implementation Method 2
low radiation outcoupling efficiency due to total internal reflection
Data Source
AI summary
In an embodiment a radiation-emitting semiconductor chip includes a first doped region, an active region adjacent to the first doped region and a second doped region arranged on a side of the active region facing away from the first doped region, wherein the first doped region is structured in a step-like manner and includes several planes in a direction perpendicular to a main extension plane of the semiconductor chip, and wherein the active region covers the first doped region on a side surface and a top surface.