Structured Wavelength Conversion Element for Multi-Pixel LED Optical Isolation
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing optoelectronic semiconductor components face challenges in achieving efficient light emission and optical separation in projection and headlight applications due to issues like optical crosstalk and color deviation, particularly in multi-pixel LED systems where radiation from adjacent elements can interfere, leading to reduced contrast and color accuracy.
Innovation Solution
The design incorporates a semiconductor chip with individually activatable elements and a structured wavelength conversion element, which is divided into partial regions with trenches to prevent crosstalk, ensuring sharp optical separation and improved color-angle characteristics. This element can be made of ceramic materials like YAG or LuAG, or phosphor in a matrix, with trenches that do not completely penetrate to maintain structural integrity and enhance thermal management.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Illumination intensity
If a multi-pixel semiconductor chip is used to improve illumination efficiency and color rendering, then the illumination intensity and color accuracy are improved, but optical crosstalk between adjacent elements occurs leading to reduced contrast ratio
Solution Approach 1:
The wavelength conversion element is divided into multiple individually addressable regions, each corresponding to a pixel element. This segmentation allows independent control of each pixel and prevents optical crosstalk by confining the wavelength conversion to specific spatial zones, thereby maintaining high contrast ratio while preserving illumination efficiency.
Solution Approach 2:
Different regions of the wavelength conversion element are assigned different converter materials with specific spectral characteristics tailored to each pixel element. This local optimization ensures that each pixel emits light with the desired color properties, improving overall color accuracy while preventing interference between adjacent elements.
2Adaptability or versatility
If electrical contact points are added to the surface of the semiconductor chip for individual element control, then the adaptability and control precision are improved, but the contact points cause shading and absorption of emitted radiation reducing illumination efficiency
Solution Approach 1:
The electrical contact structure is moved from the light-emitting surface to the rear side of the semiconductor chip. This dimensional relocation allows the front surface to remain free of obstructive contact points, preserving illumination efficiency, while the rear-side contacts provide the necessary electrical connection for individual element control through conductive structures that do not interfere with light emission.
3Manufacturing precision
If complex production methods are used to prevent optical crosstalk and improve color accuracy, then the measurement precision and manufacturing quality are improved, but the device complexity and production cost increase
Solution Approach 1:
The wavelength conversion function and the optical isolation function are merged into a single integrated element. The wavelength conversion element simultaneously performs color conversion and prevents optical crosstalk through its structured design, eliminating the need for separate complex isolation structures and simplifying the overall device architecture while maintaining high color accuracy.
Solution Approach 2:
The wavelength conversion element is designed to serve multiple functions: wavelength conversion, optical isolation, and structural support. This multi-functionality reduces the total number of components needed and simplifies the production process while achieving the desired color accuracy and preventing optical crosstalk.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reduces optical crosstalk and ensures a high contrast ratio and sharp optical separation between elements, improving the color-angle characteristic and maintaining structural stability, resulting in enhanced illumination patterns and reduced color deviation in projection and headlight applications.
Implementation Method 1
The wavelength conversion element is implemented for the at least partial conversion of the primary radiation, which is emitted from the semiconductor chip and in particular from the elements, into electromagnetic secondary radiation
Data Source
AI summary
An optoelectronic semiconductor component and a method for producing an optoelectronic semiconductor component are disclosed. In an embodiment, the component includes a carrier, a multi-pixel semiconductor chip that emits electromagnetic radiation during operation, wherein the semiconductor chip is arranged on the carrier, and wherein the semiconductor chip has a plurality of individually activatable pixels capable of generating primary radiation and a wavelength conversion element for at least partially converting the primary radiation emitted from the semiconductor chip into electromagnetic secondary radiation, wherein an active zone of the multi-pixel semiconductor chip extends continuously over the plurality of pixels, and wherein the wavelength conversion element is implemented in one piece.