Semiconductor Die Attachment Using Embedded Stud Bumps
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Solution Overview
Problem
Aluminum-based joining pads in semiconductor devices have high resistivity and are prone to oxidation, leading to unstable resistance and intermittent faults, while alternative noble metal solutions increase manufacturing costs.
Innovation Solution
The use of stud bumps made from conductive materials like gold, directly contacting the die attachment pad after removing a thin oxidation layer using ultrasound processing, eliminates the need for expensive noble metals and maintains electrical performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If aluminum-based joining pads are used for die attachment, then manufacturing cost is reduced, but electrical connection stability deteriorates due to oxidation and high resistivity
Solution Approach 1:
The patent employs a composite material structure consisting of an aluminum-based joining pad combined with a noble metal layer (such as palladium, nickel, or gold). This composite structure allows the aluminum base to provide low cost while the noble metal layer provides oxidation resistance and stable electrical properties, effectively resolving the contradiction between manufacturing cost and electrical connection stability
Solution Approach 2:
The patent modifies the surface properties of the aluminum-based joining pad by forming a noble metal layer on its surface. This parameter change (adding a surface layer) transforms the aluminum pad from being prone to oxidation to having oxidation-resistant properties, while maintaining the cost advantages of aluminum and achieving stable electrical connections
2Reliability
If noble metal (palladium, nickel, gold) is used for die attachment pads, then electrical connection stability is improved, but manufacturing cost increases significantly
Solution Approach 1:
The patent applies noble metal only locally on the surface of the aluminum-based joining pad where electrical contact is needed, rather than using noble metal for the entire structure. This local application provides oxidation resistance and stable electrical properties at the critical interface while keeping the overall manufacturing cost low by using inexpensive aluminum for the bulk material
3Ease of manufacture
If aluminum is used for joining pads, then manufacturing cost is reduced, but resistivity increases and oxidation resistance deteriorates
Solution Approach 1:
The patent creates a composite material system where aluminum provides the base structure with low cost and good conductivity, while a noble metal layer (palladium, nickel, or gold) is deposited on the surface to provide oxidation resistance. This composite approach allows simultaneous achievement of low manufacturing cost and high oxidation resistance
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces manufacturing costs and ensures stable electrical connections between semiconductor devices without the drawbacks of aluminum oxidation, achieving reliable performance comparable to noble metal solutions.
Implementation Method 1
The semiconductor device is processed using ultrasound, such that at least a portion of a metal oxide layer on a surface of the die attachment pad is removed so as to implement the direct contact between the die attachment pad and the stud bump.
Data Source
AI summary
The embodiments of the present disclosure relate to a semiconductor device and a manufacturing method therefor. The semiconductor device comprises: a die attachment pad; a stud bump located on the die attachment pad and in direct contact with the die attachment pad; a first die located on the stud bump and electrically coupled to the stud bump; and a conductive attachment material located between the die attachment pad and the first die.