Stud Bump Through Electrode for Compact Semiconductor Packaging
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Solution Overview
Problem
The downsizing of semiconductor devices is hindered by the need for wide electrode pitch of solder balls to prevent short-circuiting, which complicates high-precision mounting and inspection, limiting the miniaturization of semiconductor structures.
Innovation Solution
A semiconductor device with a through electrode formed as a stud bump, allowing for reduced electrode pitch and size, while maintaining stability and ease of electrical coupling, by using a connection electrode with a stud bump that passes through a sealing resin and is electrically coupled with a land electrode, enabling compact layering and mounting.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If solder ball electrode pitch is reduced to downsize semiconductor devices, then device size is reduced, but short-circuiting risk increases and mounting precision requirements increase
Solution Approach 1:
The electrode structure is segmented into multiple functional parts: the semiconductor chip has electrodes on its lower surface, the wiring substrate has land electrodes, and stud bumps are formed as separate connecting elements. This segmentation allows each component to be optimized independently, enabling reduced pitch while maintaining reliability through precise control of each element's dimensions and positioning.
Solution Approach 2:
The invention transitions from planar electrode connections to three-dimensional connections using stud bumps that extend vertically from the wiring substrate through the sealing resin to contact the semiconductor chip electrodes. This dimensional change allows for compact pitch in the planar direction while maintaining adequate connection spacing and reliability through the vertical dimension.
2Volume of moving object
If solder ball electrode pitch is reduced, then device size is reduced, but mounting precision and inspection difficulty increase
Solution Approach 1:
The stud bumps are formed with a specific material composition and surface characteristics that provide distinct visual contrast and detectability. The electrode structures include reflective metal surfaces and distinct geometric features that facilitate automated optical inspection and precise measurement, even at reduced pitch dimensions.
Solution Approach 2:
The stud bumps are pre-formed on the wiring substrate before semiconductor chip mounting, establishing precise reference positions and connection geometries in advance. This preliminary formation of connection structures enables subsequent automated mounting processes to operate with higher precision and simplifies inspection by providing predetermined reference features.
3Volume of moving object
If stud bump through electrode is used, then electrode pitch can be reduced and device downsized, but manufacturing complexity increases
Solution Approach 1:
The stud bump structure serves multiple functions simultaneously: it acts as an electrical connection element, a mechanical support structure, a positioning reference, and an inspection feature. This multi-functionality consolidates what would otherwise require multiple separate components and processes, reducing overall manufacturing complexity despite the three-dimensional structure.
Solution Approach 2:
The invention merges the formation of electrical connections, mechanical support structures, and positioning features into a single integrated stud bump structure. By combining these functions into one element formed through coordinated processing steps, the manufacturing complexity is managed more efficiently than through separate components.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach allows for the downsizing of semiconductor devices without compromising convenience in packaging or electrical testing, as the stud bump through electrode reduces the size of the semiconductor device while maintaining stability and ease of electrical coupling.
Implementation Method 1
a through electrode formed on an upper surface of the first land electrode so as to be electrically coupled with the first land electrode using a stud bump
Data Source
AI summary
A semiconductor device includes a semiconductor chip, a connection electrode including a first land electrode electrically coupled with the semiconductor chip, and a through electrode formed on an upper surface of the first land electrode to be electrically coupled with the first land electrode using a stud bump, and a sealing resin, through which the connection electrode passes, for sealing the semiconductor chip.