Thermal Management Stud Bumps for Transient Heat Dissipation
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Solution Overview
Problem
High power semiconductor devices face challenges in dissipating heat during transient operations, leading to increased junction temperatures that limit power handling capacity and can cause damage.
Innovation Solution
The implementation of thermal management stud bumps on the metal bonding surface of the die to locally dissipate heat generated during transient operations, acting as both heat sinks and capacitors to suppress temperature rise.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If thicker copper layers are used to dissipate heat, then heat dissipation capability is improved, but manufacturing cost and die stress increase
Solution Approach 1:
The patent applies local quality by placing stud bumps only at specific hot spot locations on the die rather than using uniform thick copper layers across the entire die. This localized approach concentrates thermal management resources where they are most needed, achieving effective heat dissipation while minimizing additional material usage and manufacturing complexity.
Solution Approach 2:
The patent segments the heat dissipation function into discrete stud bump structures positioned at specific locations rather than using a continuous thick copper layer. This segmentation allows for targeted thermal management at hot spots while reducing overall material usage and associated manufacturing costs and stresses.
2Temperature
If more heat dissipating structures are added, then heat dissipation is improved, but device complexity increases
Solution Approach 1:
The patent implements local quality by positioning stud bumps specifically at hot spot locations identified through thermal analysis, rather than distributing heat dissipating structures uniformly across the entire device. This targeted approach achieves effective heat management while maintaining simpler overall device architecture.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach effectively reduces peak temperature rise, maximizes power ON cycle duration, and increases total power output while minimizing the need for thick copper layers, reducing stress and costs, and enhancing reliability.
Implementation Method 1
thermal management stud bumps formed on a metal bonding surface of the die to store and dissipate heat generated in the high power die during transient operations
Implementation Method 2
thermal management stud bumps formed on a metal bonding surface of the die to store and dissipate heat generated in the high power die during transient operations
Data Source
AI summary
A thermal management configuration for a flip chip semiconductor device is disclosed. The device includes a high power silicon based die having a metal bonding surface. A plurality of interconnects are formed on the metal surface and connected to a substrate. A plurality of thermal management stud bumps are formed on the metal bonding surface, the thermal management stud bumps positioned distinct from the interconnects and local to die hot spots, exposed ends of the thermal management stud bumps spaced from the substrate.