Electronic Package Sub-Matrix Circuit Through-Hole Interconnect
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Solution Overview
Problem
Conventional manufacturing of photovoltaic devices requires different thin-film processes for various sizes and functions, leading to high costs and lack of flexibility due to the need for expensive TFT manufacturing processes, photomasks, and substrates.
Innovation Solution
A manufacturing method involving an insulation substrate with sub-matrix circuits and functional chips, where through-holes are formed and filled with conductive material to connect the chips to the second surface, allowing for flexible production of electronic packages suitable for diverse products without the need for multiple TFT processes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If thin-film processes are used to drive photovoltaic components, then device functionality is achieved, but manufacturing cost increases and flexibility decreases
Solution Approach 1:
The patent extracts the thin-film transistor manufacturing process from the photovoltaic device manufacturing. Instead of integrating TFTs directly into the photovoltaic substrate, the invention uses separate driver circuits on a different substrate that are electrically connected to the photovoltaic components through conductive connections, thereby eliminating the need for expensive TFT processes while maintaining device functionality
Solution Approach 2:
The patent segments the device into separate functional modules: photovoltaic components on one substrate and driver circuits on another substrate. This segmentation allows each module to be manufactured independently using optimized processes, reducing overall manufacturing cost while maintaining functionality
2Reliability
If thin-film processes are used for different product sizes and functions, then device performance is optimized, but manufacturing complexity increases
Solution Approach 1:
The patent creates a universal driver circuit substrate that can drive photovoltaic components of different sizes and functions. The driver circuit substrate is designed with standardized interfaces and conductive connection patterns that can accommodate various photovoltaic component configurations, thereby reducing manufacturing process complexity while maintaining optimized performance for different products
3Manufacturing precision
If photomasks and specialized substrates are used, then manufacturing precision is improved, but manufacturing cost increases
Solution Approach 1:
The patent uses standard photomasks and common substrates to create driver circuits that are then electrically connected to photovoltaic components. Instead of requiring specialized photomasks and substrates for each photovoltaic device, the invention copies the electrical connection patterns through conductive materials and bonding techniques, thereby achieving necessary manufacturing precision while using less expensive, more readily available materials
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method reduces manufacturing costs by eliminating the need for expensive TFT processes and allows for flexible production of electronic devices, making it suitable for various products with lower costs and improved application flexibility.
Implementation Method 1
forming a plurality of through-holes on the insulation substrate and disposing a conductive material in the through-holes, so that the functional chip is electrically connected to the second surface through the sub-matrix circuits and the conductive material
Implementation Method 2
The step of forming the through-holes is to provide a laser for irradiating the insulation substrate so as to form the through-holes on the insulation substrate
Data Source
Figure 1
Figure 2A~2C
Figure 2D~2F
AI summary
An electronic package unit and a manufacturing method thereof are disclosed. The manufacturing method includes: providing an insulation substrate, wherein the insulation substrate has a first surface and a second surface opposite to the first surface; forming a plurality of sub-matrix circuits on the insulation substrate, wherein each sub-matrix circuit comprises at least one thin film transistor; disposing at least one functional chip on the first surface, wherein the functional chip is electrically connected with the sub-matrix circuit; forming a plurality of through-holes on the insulation substrate and disposing a conductive material in the through-holes, so that the functional chip is electrically connected to the second surface through the sub-matrix circuits and the conductive material; forming a protection layer on the first surface to cover the functional chips; and cutting the insulation substrate and the protection layer to form a plurality of electronic package units.