Submount Based SMD Light Emitters for Low Profile LED Arrays
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Solution Overview
Problem
Conventional surface mount device (SMD) light emitter components are costly and time-consuming to produce due to individual molding of component bodies and reflector cavities, limiting their adoption and customization options for LED lighting applications.
Innovation Solution
The development of submount based SMD light emitter components that allow for the creation of multiple components from a single panel, eliminating the need for custom fabricated packages and reflector cavities, using non-metallic submounts with optical elements held by surface tension, and minimizing metallic traces to reduce interference with light emission.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional SMD light emitter components are individually molded with integrally formed reflector cavities, then manufacturing precision and structural integrity are improved, but manufacturing cost and production time increase significantly
Solution Approach 1:
The component is divided into separate elements: a pre-formed submount (can be metal or ceramic) and an optical element (lens or dome). The submount is manufactured separately using standard processes, then the optical element is applied afterward using dispensing, molding, or other low-cost techniques. This segmentation allows high-precision components to be produced efficiently through modular assembly rather than complex integral molding.
2Strength
If conventional SMD components use integrally formed component bodies with reflector cavities, then structural strength is improved, but manufacturing cost increases
Solution Approach 1:
The submount and optical element are combined to form the complete light emitter component. The submount provides structural strength and electrical connectivity, while the optical element provides light management functions. This combination achieves the functional equivalence of an integrally formed component with lower manufacturing cost, as each element can be produced using optimized, separate processes.
3Adaptability or versatility
If conventional SMD components are individually molded, then customization options are limited, but manufacturing simplicity is maintained
Solution Approach 1:
The submount serves multiple functions: it provides structural support, electrical connectivity, thermal management, and mechanical mounting. By standardizing the submount design, the same base component can support various optical elements and configurations, enabling customization of light emitter components without requiring custom manufacturing processes for each variant.
4Illumination intensity
If conventional SMD components use standard molded designs, then manufacturing efficiency is maintained, but brightness and profile optimization are limited
Solution Approach 1:
The optical element parameters (shape, size, material composition, refractive index) can be varied to optimize brightness, beam pattern, and profile height. These parameter changes are achieved through material formulation and dispensing process control rather than complex molding operations, allowing optimization of optical performance while maintaining manufacturing efficiency through simple application processes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces manufacturing costs and time, enables customized components with improved brightness and a lower profile, and allows for the production of a variety of LED lighting products with enhanced efficiency and cost-effectiveness.
Implementation Method 1
using non-metallic submounts with optical elements held by surface tension
Data Source
AI summary
Submount based surface mount design (SMD) light emitter components and related methods are disclosed. In some aspects, light emitter components can include a submount with a first side having a first surface area, first and second electrical contacts disposed on the first side of the submount, and at least one light emitter chip on the first side. In some aspects, the electrical contact area can be less than half of the first surface area of the first side of the submount. Components disclosed herein can include low profile parts or domes where a ratio between a dome height and a dome width is less than 0.5. A method of providing components can include providing a panel of material and LED chips, dispensing a liquid encapsulant material over the panel, and singulating the panel into individual submount based components after the encapsulant material has hardened.