Micro-LED Sub-Pixel Pad Layout for Uniform Emission After Repair
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Solution Overview
Problem
Micro-LED display panels face issues with display uniformity due to differences in light-emitting effects after sub-pixel repair, caused by varying positions of main and backup bonding pads relative to the sub-pixel, leading to inconsistent light emission when micro light-emitting diodes are switched.
Innovation Solution
The main and backup bonding pads are disposed in a symmetric manner with respect to symmetric reference objects, ensuring that the positions of micro light-emitting diodes connected to them are the same relative to the sub-pixel, maintaining consistent light-emitting effects even after repair.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of repair
If the main bonding pad and backup bonding pad are positioned at different locations relative to the sub-pixel, then the sub-pixel can be repaired by switching to the backup bonding pad, but the light-emitting effect of the sub-pixel after repair is significantly different from before repair, affecting display uniformity
Solution Approach 1:
The patent applies asymmetry in reverse - it deliberately creates symmetry between the main bonding pad and backup bonding pad positions. Both bonding pads are positioned at the same location relative to their respective sub-pixels, ensuring that when a micro light-emitting diode is switched from the main to the backup bonding pad, the light emission position and characteristics remain consistent, thereby maintaining display uniformity while enabling repair functionality
2Manufacturing precision
If the main bonding pad and backup bonding pad are positioned at the same location, then the light-emitting effect remains consistent after repair, but the structural complexity and manufacturing precision requirements increase
Solution Approach 1:
The patent segments the bonding pad structure into multiple identical units - each sub-pixel area contains both a main bonding pad and a backup bonding pad positioned at the same location. This segmentation allows the system to maintain simple, repetitive structures while achieving the dual function of normal operation and repair capability, reducing overall device complexity through modular design
Data Source
AI summary
Provided are a display panel and a display device. The display panel includes a first substrate. The first substrate includes mutiple sub-pixel areas arranged in an array. Each sub-pixel area includes a main bonding pad and a backup bonding pad which are disposed on the first substrate; and a micro light-emitting diode electrically connected to the main bonding pad or the backup bonding pad. The main bonding pad and the backup bonding pad are in a first symmetric manner about a first symmetric reference object. The sub-pixel area is in a second symmetric manner about a second symmetric reference object. The first symmetric manner is the same as the second symmetric manner. The distance between the vertical projection of the first symmetric reference object on the first substrate and the vertical projection of the second symmetric reference object on the first substrate is S1, and S1≤10 μm.