Subsea Electronic Cooling via Segmented Dielectric Fluid Streams
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Solution Overview
Problem
Conventional subsea converters face challenges with inefficient cooling systems that require large amounts of dielectric fluid, are bulky, and difficult to maintain, leading to high operational costs and environmental concerns due to fluid usage.
Innovation Solution
The electronic subsea system employs a modular cooling system with multiple fluid streams, utilizing natural convection to efficiently cool different components, with a second heat exchanger for temperature-sensitive components and a driving component to enhance natural convection, reducing the amount of dielectric fluid needed and improving modularity and flexibility.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If natural convection cooling is used without pumps, then device complexity is reduced, but cooling efficiency is insufficient
Solution Approach 1:
The cooling system is divided into multiple independent fluid streams (first fluid stream for semiconductor modules, second fluid stream for capacitors, third fluid stream for busbar portions) that can be optimized separately. Each stream has its own heat exchanger and flow path, allowing tailored cooling approaches for different thermal requirements while maintaining overall system simplicity through passive operation.
Solution Approach 2:
Different components receive customized cooling based on their specific thermal characteristics. Semiconductor modules get cooling from the first fluid stream with its specific heat exchanger configuration, capacitors receive cooling from the second fluid stream, and busbar portions are cooled by the third fluid stream. This local optimization enables efficient heat dissipation for each component type without requiring complex centralized control.
2Temperature
If conventional cooling systems are used, then components are cooled, but the volume of dielectric fluid required is large
Solution Approach 1:
The dielectric fluid is divided into multiple specialized streams, each optimized for specific heat removal tasks. The first fluid stream handles semiconductor module cooling, the second stream handles capacitor cooling, and the third stream handles busbar cooling. This segmentation allows more efficient heat transfer pathways and reduces the total volume of dielectric fluid needed compared to conventional single-stream systems.
Solution Approach 2:
Multiple heat exchangers act as intermediaries between the dielectric fluid and the components to be cooled. Each heat exchanger (first heat exchanger for semiconductor modules, second heat exchanger for capacitors, third heat exchanger for busbar portions) provides a dedicated thermal interface, improving heat transfer efficiency and reducing the overall quantity of dielectric fluid required in the system.
3Device complexity
If simple cooling system design is used, then device complexity is low, but adaptability to different components is limited
Solution Approach 1:
The cooling system is segmented into multiple independent fluid streams and heat exchangers that can be individually configured for different component types. This modular architecture maintains relative design simplicity while providing high adaptability - each stream can be optimized for specific thermal requirements of semiconductor modules, capacitors, or busbar portions without redesigning the entire system.
Solution Approach 2:
The cooling system achieves multi-functionality through its multiple fluid streams and heat exchangers that can serve different component types simultaneously. The same basic architectural pattern (fluid stream + heat exchanger) is applied universally across different components, providing adaptability to various thermal requirements while maintaining design consistency and simplicity.
4Reliability
If thick-walled containers are used to protect electronics, then reliability is improved, but device volume increases
Solution Approach 1:
The system transitions from a thick-walled pressure-resistant container to a thin-walled container filled with incompressible dielectric fluid. This parameter change in the container wall thickness is compensated by the fluid's ability to withstand hydrostatic pressure, maintaining reliability while significantly reducing the overall system volume and eliminating the need for bulky pressure vessels.
Solution Approach 2:
The dielectric fluid serves a dual function as both cooling medium and structural support. By utilizing the hydraulic properties of the incompressible fluid to withstand ambient hydrostatic pressure, the system eliminates the need for thick-walled mechanical containers, thereby reducing volume while maintaining the protective function for sensitive electronics.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach results in a compact, efficient, and versatile cooling system that reduces the volume of dielectric fluid required, enhances reliability, and simplifies maintenance, while adhering to environmental regulations by minimizing fluid usage and weight, thus optimizing performance and operational efficiency.
Implementation Method 1
Cooling by natural convection uses the heat exchange between the cooling liquid and the surrounding sea water to generate a circulation within the cooling system
Implementation Method 2
A heat sink is arranged on a wall of the enclosure and thermally coupled thereto. The transfer of heat by the heat sink from the dielectric liquid to the sea water surrounding the enclosure may thus be improved.
Data Source
Figure 1
Figure 2a~2b
Figure 3
AI summary
An electronic subsea system (1) such as an electric converter system, comprising a housing (2) configured to receive a dielectric fluid (3), which system comprises a first section (54) and a second section (52), and where at least two electronic modules (1a-4a) are arranged in the first section. A cooling system (6) is arranged comprising a first heat exchanger (22) in thermal connection with the dielectric fluid, and a first fluid stream path is configured to receive a first fluid stream (16) passing through the first section and the first heat exchanger. The electronic subsea system is further arranged with a second fluid stream path and a third heat exchanger (23) configured to receive a second fluid stream (18) passing through the second section (52). A driving component (19) is configured placed in a position in the second fluid stream path in the second section (52).