Substrate Alignment via Particle Pattern Image Analysis
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Solution Overview
Problem
In semiconductor manufacturing, when a substrate is not properly positioned in a processing chamber, correcting the alignment requires stopping the equipment, leading to decreased productivity and increased costs.
Innovation Solution
A substrate processing apparatus and method that use image capturing and pattern recognition to calculate alignment error values, allowing for real-time adjustment of the substrate position without stopping the equipment by determining when to introduce a sensor module and teach a transfer robot.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If substrate alignment correction is performed by stopping equipment, then manufacturing precision is improved, but productivity deteriorates
Solution Approach 1:
The system performs preliminary alignment detection by capturing images of particle patterns on the substrate lower surface before the substrate enters the processing chamber. This allows alignment correction to be prepared in advance, so that when the substrate needs correction, the adjustment can be made quickly without stopping the entire equipment sequence.
Solution Approach 2:
The patent replaces traditional mechanical alignment correction methods (which require stopping equipment) with an optical detection system using image capture and particle pattern recognition. The alignment error is calculated by analyzing particle patterns in captured images, and the transfer robot is automatically retrained to correct positioning errors, eliminating the need for manual intervention and equipment shutdown.
2Measurement precision
If sensor module is carried into chamber for precise measurement, then measurement precision is improved, but device complexity increases
Solution Approach 1:
The system uses particle patterns formed on the substrate lower surface during processing as an intermediary reference marker. Instead of requiring a separate sensor module to be physically deployed into the chamber, the particle patterns serve as a natural reference that can be captured by the existing image capture device, simplifying the measurement system while maintaining high precision.
Solution Approach 2:
The patent creates a reference copy of the loading region center position by capturing images of particle patterns and calculating the center position from these images. This optical copy of the position information allows precise measurement without requiring physical sensor deployment into the processing chamber.
Data Source
AI summary
A method includes performing a substrate processing process by carrying a substrate into a chamber, and disposing the substrate in a loading region of the chamber, capturing an image of a lower surface of the substrate to acquire a first image, identifying particle patterns formed on the lower surface of the substrate in the substrate processing process, and an edge of the substrate, from the first image, calculating a first alignment error value of a deviation between an approximate position value for the center of the loading region calculated from the particle patterns and an approximate position value for a center of the substrate calculated from the edge of the substrate, and determining a point in time for teaching a transfer robot that deposits the substrate into the chamber, based on the first alignment error value.