Substrate Bonding Structure for Condensation-Free Edge Sealing
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Solution Overview
Problem
The existing direct bonding methods in the semiconductor industry often result in edge voids due to gas condensation during the bonding process, which leads to defects in the bond interface.
Innovation Solution
The substrate surfaces are widened to ensure that gas expansion occurs outside the bonding area, preventing gas condensation and edge void formation by using substrate holders with recesses and elevations that guide the gas expansion beyond the substrate edges, maintaining a higher pressure and temperature to counteract condensation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If direct bonding is performed by bringing substrates close together and propagating a bond wave, then bonding speed and efficiency are improved, but gas condensation occurs upstream of the bond wave causing edge voids that deteriorate bond quality
Solution Approach 1:
The patent applies preliminary heating to the substrate edges before the bonding process. By pre-heating the edges to a temperature above the dew point of the gas, the method prevents gas condensation from occurring during the subsequent bond wave propagation, thereby eliminating edge voids while maintaining high bonding speed
Solution Approach 2:
The patent changes the temperature parameter at the substrate edges by applying localized heating. This temperature elevation modifies the physical state conditions upstream of the bond wave, preventing the gas from condensing and thus preventing edge void formation during rapid bonding
2Loss of time
If the bond wave propagates quickly across the substrate surface, then bonding time is reduced, but gas compression and condensation occur more severely leading to increased edge voids
Solution Approach 1:
The patent performs preliminary heating of the substrate edges before bond wave initiation. This pre-action ensures that when the bond wave propagates quickly, the gas upstream remains above its dew point and does not condense, thus preventing edge voids even during rapid bonding
Solution Approach 2:
The patent applies preliminary anti-action by heating the edges to counteract the harmful condensation effect before it can occur. This preemptive measure opposes the gas condensation tendency that would otherwise be caused by rapid bond wave propagation
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach effectively reduces or eliminates edge voids in fusion-bonded substrates, improving the bond quality and reliability by controlling the gas expansion and temperature conditions.
Implementation Method 1
The substrate surfaces are widened to ensure that gas expansion occurs outside the bonding area
Implementation Method 2
preventing gas condensation and edge void formation by using substrate holders with recesses and elevations that guide the gas expansion beyond the substrate edges
Data Source
AI summary
A device, a system and a method for bonding two substrates. A first substrate holder has a recess and an elevation.