Substrate Bonding Protrusion Layout for Bubble-Free Alignment
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The existing methods for bonding substrates often result in air bubbles between the substrates, leading to bonding failures due to the inability to effectively align and contact the surfaces without introducing air pockets.
Innovation Solution
A bonding method and device that form a protrusion on one substrate, allowing it to be precisely aligned and contacted with another substrate, creating a contact region that enlarges to ensure a strong bond while minimizing air bubbles by using a substrate holder with a projecting member to form and position the protrusion before alignment and bonding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional substrate bonding methods are used, then the bonding process is simple, but air bubbles remain between substrates causing bonding failure
Solution Approach 1:
The protrusion is formed on the first substrate before the bonding process begins. This preliminary structural modification enables the bonding surfaces to contact properly from the outset, preventing air bubble entrapment during subsequent substrate alignment and bonding operations.
Solution Approach 2:
The protrusion acts as an intermediary element between the two substrate surfaces. It facilitates initial contact and provides a controlled interface for bonding, allowing air to be systematically expelled from the bonding region while maintaining surface alignment.
2Manufacturing precision
If substrate surfaces are brought into contact without protrusions, then the alignment process is straightforward, but air bubbles are trapped between substrates
Solution Approach 1:
The protrusion structure is prepared in advance on the first substrate through selective thinning or removal. This pre-formed feature guides the alignment process by providing a definitive contact point, ensuring precise substrate positioning while eliminating the need for complex real-time alignment adjustments.
3Productivity
If the contact region is enlarged quickly, then bonding speed increases, but air bubbles are trapped in the bonding interface
Solution Approach 1:
The protrusion is formed beforehand to establish an initial contact point that serves as a controlled entry for the bonding wave. This allows the contact region to expand systematically from the protrusion outward, maintaining air evacuation pathways open during the bonding process while achieving rapid overall bonding speed.
Data Source
AI summary
A method for bonding a first substrate and a second substrate includes: forming a protrusion at a partial region of the first substrate; measuring a position of the first substrate after the protrusion is formed in the first substrate; and bonding the first substrate and the second substrate by contacting the protrusion of the first substrate with a surface of the second substrate to form a contact region and enlarging the contact region.