Substrate Connection Member With Bridge Across Opening
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Solution Overview
Problem
In electronic devices with densely arranged components, the strength of signals transmitted through printed circuit board wires is reduced due to structural interference, leading to signal degradation.
Innovation Solution
A substrate connection member with a through-wire formed in an opening part of a printed circuit board, connected by a bridge across multiple layers, minimizes signal interference by using conductive members on the inner and side surfaces to enhance signal transmission efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If multiple components are densely arranged to reduce electronic device size, then device miniaturization is achieved, but signal interference between components increases
Solution Approach 1:
The patent extracts the signal transmission function from the conventional planar PCB trace approach and relocates it to a three-dimensional through-wire structure passing through the substrate. This spatial extraction allows signal paths to be separated from interfering components by moving them through the substrate thickness dimension, thereby reducing electromagnetic interference while maintaining compact device layout.
Solution Approach 2:
The patent transitions from two-dimensional signal transmission on PCB surfaces to three-dimensional signal transmission through substrate openings. By utilizing the vertical dimension (through the substrate thickness), the signal paths are separated from planar component arrangements, enabling miniaturization without signal interference.
2Reliability
If conventional through-wire structure is used for signal transmission, then component electrical connection is achieved, but signal strength is reduced
Solution Approach 1:
The patent introduces a conductive member as an intermediary element lining the interior surface of the substrate opening. This conductive intermediary creates a controlled impedance transmission environment within the opening, shielding the through-wire from external electromagnetic interference and maintaining signal integrity during transmission through the substrate.
Solution Approach 2:
The patent applies different structural characteristics to different regions: the through-wire provides the primary signal path, while the conductive member lining the opening provides localized electromagnetic shielding and impedance control. This local differentiation optimizes signal transmission quality without requiring complete enclosure or complex overall structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration improves signal transmission efficiency by reducing signal loss and interference between densely packed components in electronic devices, maintaining signal strength across stacked printed circuit boards.
Implementation Method 1
an inner surface of the opening part and a side surface of the bridge are formed of a conductive member
Data Source
AI summary
A substrate connection member according to various embodiments of the present invention can comprise a printed circuit board which has a plurality of layers that are stacked and which comprises a front surface, a rear surface, and a side surface encompassing the front surface and the rear surface. The printed circuit board can comprise: an opening part which encompasses a partial region of the printed circuit board and which is penetratingly formed from the front surface to the rear surface; at least one bridge connected between the partial region and the printed circuit board by crossing at least a portion of the opening part; and at least one through-hole wire formed in the partial region from the front surface to the rear surface, wherein the inner surface of the opening part and the side surface of the bridge can be formed from a conductive member. Other various embodiments, in addition to the embodiments disclosed in the present invention, are possible.