Substrate Cavity Package Layout for Heat Dissipation in Thin IC Packages
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Solution Overview
Problem
Existing packages with integrated devices face challenges in efficient heat dissipation, which can negatively impact device performance and require larger sizes to accommodate thermal management solutions.
Innovation Solution
A package design featuring a first substrate with a first integrated device, a second substrate with a cavity, and an encapsulation layer between them, utilizing solder interconnects for coupling, where the second substrate's cavity and thicker die substrate enhance thermal conductivity for improved heat dissipation without increasing overall package thickness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If traditional package structures are used, then package size can be kept small, but heat dissipation capability is insufficient
Solution Approach 1:
The patent introduces a cavity dimension within the substrate structure, transforming the traditional planar package layout into a three-dimensional configuration. The cavity creates vertical space for thermal management components without expanding the package's footprint, allowing heat dissipation solutions to be integrated within the existing volume envelope.
Solution Approach 2:
The patent embeds thermal management components within the substrate cavity, creating a nested structure where heat dissipation elements are contained within the package body. This nesting approach allows thermal management functionality to be integrated without adding external volume, as the cooling components are housed within the existing package boundaries.
2Temperature
If thicker die substrate is used to improve thermal conductivity, then heat dissipation is enhanced, but package thickness increases
Solution Approach 1:
The patent redistributes thermal management functionality across multiple dimensions by creating a cavity within the substrate. This allows the use of thermally conductive materials and heat dissipation structures that extend vertically into the cavity space rather than requiring increased substrate thickness, thereby maintaining the package's external thickness while improving internal thermal management.
Solution Approach 2:
The patent segments the substrate structure by introducing a cavity that divides the substrate into distinct regions. This segmentation allows different materials with varying thermal properties to be placed in different zones, optimizing heat dissipation pathways without requiring a uniform increase in substrate thickness throughout the entire package.
3Temperature
If more thermal management components are added, then heat dissipation improves, but device complexity increases
Solution Approach 1:
The patent combines multiple functions into the substrate structure itself by integrating the cavity formation, thermal management component housing, and mechanical support functions into a single substrate design. This merging approach eliminates the need for separate thermal management modules, reducing overall package complexity while maintaining effective heat dissipation capability.
Solution Approach 2:
The substrate cavity serves multiple functions simultaneously: it provides structural support, houses thermal management components, enables heat dissipation pathways, and maintains package thickness constraints. This multi-functionality reduces the need for additional dedicated components, thereby simplifying the overall device architecture while achieving effective thermal management.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively enhances heat dissipation capabilities of integrated devices, maintaining package size while improving thermal management, thus ensuring better performance and reliability.
Implementation Method 1
a first integrated device coupled to the first substrate through at least a first plurality of solder interconnects; a second substrate coupled to the first substrate through at least a second plurality of solder interconnects
Data Source
AI summary
A package comprising a first substrate; a first integrated device coupled to the first substrate through at least a first plurality of solder interconnects; a second substrate coupled to the first substrate through at least a second plurality of solder interconnects, wherein the second substrate includes a cavity; and an encapsulation layer located at least between the first substrate and the second substrate, wherein the encapsulation layer is coupled to the first substrate, the second substrate and the first integrated device.