Mounting Substrate Channel Layout for Dust-Safe Gas Replacement
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Solution Overview
Problem
Electronic element mounting substrates face issues with dust entering through channels during gas injection/discharge, potentially causing short circuits due to dust accumulation near electrodes, especially during vibration, and the risk of wire bending or reduced bonding strength due to gas pressure.
Innovation Solution
The electronic element mounting substrate design includes a channel with an inner end open to a recessed portion and an outer end continuous with a cutout section, which reduces dust entry and gas pressure on wires by positioning the channel away from electrode pads, thereby minimizing the risk of short circuits and maintaining bonding strength.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If a channel is provided for gas injection/discharge, then gas replacement capability is improved, but dust entry risk increases
Solution Approach 1:
A cap member is introduced as an intermediary component that selectively covers the channel opening. The cap member allows gas to pass through while blocking dust particles, acting as a mediator between the gas injection function and dust prevention requirement. The cap member includes a through-hole that permits gas flow but its structure prevents dust entry into the recessed portion.
2Device complexity
If the channel is positioned near electrodes for compact design, then device complexity is reduced, but short circuit risk increases due to dust accumulation
Solution Approach 1:
The cap member serves as a protective intermediary positioned over the channel opening near the electrodes. It blocks dust from entering the channel and accumulating near the electrodes, thereby preventing potential short circuits while allowing the channel to remain in its compact position close to the electrode structure.
3Productivity
If gas pressure is applied for efficient gas injection, then gas replacement efficiency is improved, but wire bonding strength deteriorates
Solution Approach 1:
The cap member is positioned and secured before gas injection begins. This preliminary action establishes a controlled interface that guides gas flow through the through-hole while preventing direct high-pressure gas impact on the wire bonds. The cap member acts as a flow distributor that maintains injection efficiency without compromising bonding strength.
Data Source
AI summary
An electronic element mounting substrate according to the present disclosure includes a base body having a recessed portion including a mounting region on which an electronic element is mounted and a cutout section located on an outer periphery of the base body in a plane perspective, and a channel having an inner end portion located on an inner wall of the base body and an outer end portion located on the outer periphery of the base body. The inner end portion of the channel is open to the recessed portion, and the outer end portion of the channel is continuous with the cutout section.