Substrate Check Marks for Conductive Glue Position Accuracy
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Solution Overview
Problem
Current methods for inspecting the position accuracy of conductive glue on substrates rely on relative coordinates, leading to potential deviations in glue placement, which can cause signal transmission issues, image flickering, and reduced panel production efficiency.
Innovation Solution
A substrate with check marks near the transfer pad is used, allowing for accurate inspection of conductive glue placement through image capture and comparison to predetermined standards, ensuring correct glue positioning and quantity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the area of transfer pad is expanded to raise the chance of dropping conductive glue onto the transfer pad, then the reliability of signal transmission is improved, but the productivity decreases due to reduced number of panels that can be cut from glass substrates
Solution Approach 1:
The patent replaces the mechanical coordinate-based inspection system with an optical inspection system using check marks and image capture. This allows for precise positioning without requiring enlarged transfer pads, thereby maintaining signal transmission reliability while improving panel production efficiency through smaller, more densely packable transfer pads
Solution Approach 2:
The check marks serve as intermediary reference elements between the transfer pad and the inspection machine. These check marks enable precise positioning and verification of conductive glue placement without requiring the transfer pad itself to be enlarged, thus resolving the contradiction between reliability and productivity
2Device complexity
If relative coordinate based inspection is used, then the device complexity is reduced, but the measurement precision deteriorates leading to glue placement deviation
Solution Approach 1:
The check marks are pre-formed on the substrate before the conductive glue dispensing process. This preliminary action provides fixed reference points that enable precise measurement and verification of glue placement accuracy, improving measurement precision without significantly increasing device complexity
Solution Approach 2:
The inspection machine captures an image of the check marks and conductive glue to create a visual copy for analysis. This optical copying method enables precise measurement of glue placement relative to the transfer pad boundaries without requiring complex mechanical measurement systems
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method reduces signal transmission errors, prevents image issues, and allows for a smaller transfer pad design, increasing panel production capacity and glass substrate utilization.
Implementation Method 1
capturing an image of the transfer pad alone or with check marks by a video capturing element
Data Source
AI summary
The invention relates to a substrate with a check mark and a method of inspecting position accuracy of conductive glue dispensed on the substrate. The method is implemented on the substrate having at least one transfer pad and at least one check mark arranged near the border of the transfer pad. After the conductive glue spot is dispensed on the transfer pad, the method includes first capturing an image by a video capturing element, then determining whether the conductive glue spot exist in the image and determining whether the conductive glue spot from the image matches a predetermined standard, if not, generating a report and a warning.