Substrate Chuck Frame Structure for Buoyancy-Stable MicroLED Assembly

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Solution Overview

Problem

Current methods for manufacturing large-area displays using microLEDs face challenges in transferring and assembling semiconductor light-emitting diodes, including low success rates, limited yields, and substrate damage due to buoyancy during self-assembly.

Innovation Solution

A substrate chuck system that allows one surface of a substrate to be submerged in a fluid, using overlapping frames with a frame transfer part to vertically move the second frame, pressing the substrate and preventing fluid penetration, while utilizing a magnetic field and electric field for precise assembly of microLEDs.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If self-assembly method is used for transferring microLEDs, then productivity is improved, but reliability deteriorates due to substrate damage from buoyancy

Engineering Contradiction:
Improvetransfer efficiencyVSAvoidsubstrate integrity
Core Design Contradiction:
ProductivityVSReliability

Solution Approach 1:

The patent applies counterweight principle by introducing a pressing mechanism that exerts downward force on the substrate to counterbalance the upward buoyancy force generated during fluid-based self-assembly. The pressing mechanism includes a pressing member that can apply controlled pressure to the substrate surface, preventing substrate deformation and damage while maintaining the fluid environment necessary for microLED self-assembly.

Inventive Principle:
Principle #8Anti-weight (Counterweight)

Solution Approach 2:

The patent uses a pressing mechanism as an intermediary element between the substrate and the external environment. This intermediary component mediates the interaction between the substrate and buoyant forces by providing a controlled contact interface that distributes pressure evenly across the substrate surface, preventing direct damage from uncontrolled buoyancy forces.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Manufacturing precision

If substrate is submerged in fluid for self-assembly, then manufacturing precision is improved, but harmful factors increase due to buoyancy-induced substrate breakage

Engineering Contradiction:
Improvepositioning accuracyVSAvoidsubstrate breakage
Core Design Contradiction:
Manufacturing precisionVSObject-affected harmful factors

Solution Approach 1:

The pressing mechanism provides counterbalancing force to offset the harmful buoyancy effects while maintaining the fluid submersion environment. By applying controlled downward pressure, the system preserves the precision benefits of fluid-based self-assembly while eliminating the substrate breakage risk.

Inventive Principle:
Principle #8Anti-weight (Counterweight)

Solution Approach 2:

The pressing mechanism acts as a protective cushioning element that is positioned beforehand to prevent substrate damage before it can occur. The mechanism is designed to engage and apply protective pressure during the entire self-assembly process, cushioning the substrate against harmful buoyancy forces throughout the operation.

Inventive Principle:
Principle #11Beforehand cushioning (Prior cushioning)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Enables high-reliability, low-cost, and efficient transfer of large numbers of microLEDs onto a large-area substrate, preventing substrate damage and ensuring precise positioning, thus facilitating the manufacture of large-area display devices.

Implementation Method 1

there is a need for a new structure that prevents a substrate from being broken due to buoyancy acting on the substrate

Methodology Applied
Scientific EffectBuoyancy: Archimedes' Principle (Buoyancy)

Implementation Method 2

utilizing a magnetic field and electric field for precise assembly of microLEDs

Methodology Applied
Scientific EffectMagnetic field: Magnetic Field

Implementation Method 3

utilizing a magnetic field and electric field for precise assembly of microLEDs

Methodology Applied
Scientific EffectElectric field: Electric Field

Data Source

PatentUS11901208B2Substrate chuck for self-assembling semiconductor light emitting diodes
Publication Date: 2024.02.13 LG ELECTRONICS INC
  • US11901208B2 patent drawing
  • US11901208B2 patent drawing
  • US11901208B2 patent drawing

AI summary

Discussed is a substrate chuck for allowing one surface of a substrate to be in contact with a fluid, the substrate chuck including a first frame having a hole at a central portion thereof; a second frame having a hole at a central portion thereof and disposed to overlap the first frame; and a frame transfer part configured to vertically move the second frame with respect to the first frame, wherein the first frame includes: a bottom portion at which the hole is formed; and a sidewall portion formed on a peripheral edge of the bottom portion, and wherein a height of the sidewall portion is greater than a depth at which the substrate is placed into the fluid.