Substrate Cleaning Apparatus Asymmetric Sponge Tool
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing substrate cleaning apparatuses, particularly pen-type systems, fail to thoroughly clean the central area of the sponge cleaning tool, leading to particle reattachment and reduced cleaning performance over time, necessitating frequent replacements and increased operational downtime.
Innovation Solution
A substrate cleaning apparatus with a cleaning element having a central portion positioned higher than the surrounding areas, featuring a slope portion and radially extending grooves, ensures thorough cleaning of the sponge tool by pressing the central area firmly against the cleaning element and allowing particles to flow down with water, preventing reattachment and extending the tool's operational life.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the pen-sponge is pressed against the flat cleaning surface of the cleaning element, then the cleaning contact is established, but the central area of the pen-sponge cannot be cleaned sufficiently and particles may be reattached
Solution Approach 1:
The cleaning element surface is designed with an asymmetric profile where the central portion protrudes higher than the peripheral portion. This asymmetric height difference creates different contact pressures across the pen-sponge surface, with the central area experiencing greater pressure for thorough cleaning while the peripheral area allows particle runoff.
Solution Approach 2:
The cleaning element features a curved, domed central portion rather than a flat surface. This curvature allows the cleaning element to conform to and press firmly against the central area of the pen-sponge, improving cleaning effectiveness in this previously insufficient region.
2Duration of action of moving object
If the pen-sponge is used repeatedly for wafer cleaning, then cleaning function is maintained, but particles accumulate in the pen-sponge reducing cleaning performance
Solution Approach 1:
The cleaning element is positioned to clean the pen-sponge continuously during the wafer cleaning operation. Particles are removed from the pen-sponge in advance before they can accumulate to problematic levels, maintaining cleaning performance throughout the pen-sponge's service life.
Solution Approach 2:
The pen-sponge cleans itself by contacting the cleaning element during normal operation. The relative motion between the rotating pen-sponge and the cleaning element automatically removes accumulated particles without requiring external intervention or separate cleaning cycles.
3Reliability
If particles are removed from the pen-sponge to the cleaning element, then cleaning performance improves, but particles may be reattached to the pen-sponge
Solution Approach 1:
The asymmetric height profile creates a unidirectional particle transfer path. The higher central portion removes particles from the pen-sponge, while the lower peripheral portion allows particles to slide off and drain away, preventing reattachment to the cleaned central area.
Solution Approach 2:
The cleaning element surface is designed with vertical height variation (protruding central portion) in addition to the horizontal cleaning contact. This third dimension (height) creates a particle runoff path that directs removed particles away from the pen-sponge contact area, preventing reattachment.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively maintains cleaning performance for a longer period, reduces the frequency of sponge replacements, and decreases operational stop times by ensuring thorough cleaning and preventing particle reattachment, thereby lowering costs and improving efficiency.
Implementation Method 1
The sponge cleaning tool is pressed against the cleaning element while the sponge cleaning tool is being rotated about its central axis, thereby cleaning a surface of the substrate
Implementation Method 2
a central portion of the cleaning surface being located at a higher position than a portion, of the cleaning surface, outside the central portion
Data Source
AI summary
A substrate cleaning apparatus which can sufficiently clean a pen-sponge in its entirety, and can prevent particles, which have been once removed, from being reattached to the pen-sponge is disclosed. The substrate cleaning apparatus includes: a substrate holder configured to hold and rotate a substrate; a sponge cleaning tool to be brought into contact with a surface of the substrate; a cleaning element provided adjacent to the substrate held by the substrate holder; and a cleaning-tool moving mechanism configured to bring the sponge cleaning tool into contact with the cleaning element. The cleaning element has a cleaning surface that is to come in contact with the sponge cleaning tool, and a central portion of the cleaning surface is located at a higher position than a portion, of the cleaning surface, outside the central portion.