Substrate Cleaning Device Tilted Nozzles Particle Re-adhesion
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Solution Overview
Problem
Existing substrate cleaning methods face challenges in efficiently discharging cleaning liquid containing particles from the center of a substrate during rotation, leading to potential re-adhesion of particles due to insufficient centrifugal force, which affects the yield of semiconductor devices.
Innovation Solution
A substrate cleaning device with a first and second spray unit is employed, where the second spray unit is positioned on either the downstream or upstream side of the first spray unit relative to the rotation direction of the top ring, and the spray nozzles are tilted to promote the flow of cleaning liquid towards the outer circumference, enhancing particle elimination and preventing re-adhesion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If cleaning liquid is sprayed onto the substrate while rotating, then particles are removed from the outer circumference, but cleaning liquid containing particles remains at the center and may re-adhere to the substrate
Solution Approach 1:
The cleaning system is divided into multiple spray units positioned at different locations (first spray unit and second spray unit) to address different regions of the substrate. The first spray unit cleans the outer circumference while the second spray unit targets the center region, ensuring comprehensive cleaning without leaving contaminated liquid that could cause re-adhesion.
Solution Approach 2:
A blowing nozzle is introduced as an intermediary device that sprays gas toward the substrate to assist cleaning liquid discharge. The gas flow acts as a mediator to accelerate the removal of cleaning liquid containing particles from the substrate surface, particularly from the center region where centrifugal force is insufficient.
2Device complexity
If only a single spray unit is used, then the device structure is simple, but cleaning liquid containing particles is not efficiently discharged from the center of the substrate
Solution Approach 1:
The cleaning function is segmented into multiple spray units positioned at different locations around the substrate. The first spray unit is positioned to spray toward the outer circumference while the second spray unit is positioned to spray toward the center region, ensuring efficient discharge of cleaning liquid from all areas including the center where centrifugal force is weakest.
Solution Approach 2:
A blowing nozzle is introduced as an intermediary device that sprays gas toward the substrate to assist cleaning liquid discharge. The gas flow acts as a mediator to accelerate the removal of cleaning liquid containing particles from the substrate surface, particularly from the center region where centrifugal force is insufficient.
3Quantity of substance
If spray nozzles are positioned to spray upward, then cleaning liquid covers the substrate surface, but cleaning liquid is not directed toward the outer circumference for efficient discharge
Solution Approach 1:
Different spray units are positioned and oriented to address different regions of the substrate with appropriate spray directions. The first spray unit sprays toward the outer circumference while the second spray unit sprays toward the center region. The blowing nozzle sprays gas in a direction that assists outward discharge of cleaning liquid, ensuring each region receives appropriate treatment for efficient particle removal.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The configuration effectively discharges cleaning liquid and particles to the outside, reducing re-adhesion and improving the cleanliness of the substrate surface, thereby enhancing the yield of semiconductor devices.
Implementation Method 1
the cleaning liquid containing the particles is discharged to the outside from the outer circumference of the substrate by centrifugal force associated with the substrate rotation
Implementation Method 2
The cleaning liquid from the second spray unit urges the cleaning liquid sprayed from the first spray unit toward the outer circumferential part of the substrate
Data Source
AI summary
A substrate cleaning device for cleaning a surface of a substrate having been polished is provided in correspondence with a cleaning position of the top ring. The substrate cleaning device includes: a first spray unit that sprays cleaning liquid toward the substrate present in the cleaning position; and a second spray unit that sprays cleaning liquid toward the substrate present in the cleaning position. The second spray unit is provided on either a downstream side or an upstream side of the first spray unit, with respect to a rotation direction of the top ring present in the cleaning position. A spray nozzle structuring the second spray unit is tilted toward the first spray unit. The second spray unit urges the cleaning liquid sprayed from the first spray unit toward the outer circumferential part of the substrate.