Coordinated Etching and Rinsing Nozzles for Substrate Cleaning
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Solution Overview
Problem
Conventional substrate cleaning apparatuses require separate etching and rinsing processes, leading to prolonged cleaning times and reduced throughput.
Innovation Solution
A substrate cleaning apparatus featuring a chemical liquid nozzle for etching and a two-fluid nozzle for rinsing, both moved from the center to the periphery of the substrate in a coordinated manner, allowing for simultaneous etching and rinsing in a single pass.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If separate etching and rinsing processes are used, then cleaning can be performed thoroughly, but cleaning time increases and throughput decreases
Solution Approach 1:
The patent combines the etching nozzle and rinsing nozzle into a single integrated assembly that moves together across the substrate. The etching liquid supply unit and rinsing liquid supply unit are positioned adjacent to each other, allowing both processes to occur simultaneously in one pass across the substrate, eliminating the need for separate sequential operations.
Solution Approach 2:
The patent employs a moving mechanism that dynamically transports both the etching nozzle and rinsing nozzle across the substrate surface. This dynamic approach allows continuous simultaneous processing across the entire substrate area, rather than static sequential processing, thereby reducing total cleaning time while maintaining thoroughness.
2Reliability
If separate etching and rinsing processes are used, then each process can be optimized independently, but the overall cleaning time is prolonged
Solution Approach 1:
The patent establishes continuous useful action by having the etching and rinsing nozzles move simultaneously across the substrate in a coordinated manner. The etching process and rinsing process occur continuously and concurrently throughout the substrate area, eliminating idle time between processes and maintaining constant productive action throughout the cleaning cycle.
3Reliability
If multiple separate cleaning stations are provided, then comprehensive cleaning can be achieved, but device complexity increases
Solution Approach 1:
The patent segments the cleaning function into two distinct but integrated nozzle units: an etching nozzle and a rinsing nozzle. These segmented units are positioned adjacent to each other and move together, providing comprehensive cleaning functionality while avoiding the complexity of multiple separate stationary cleaning stations.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach significantly reduces the time required for cleaning substrates, enhancing throughput by completing etching and rinsing processes in a single operation.
Implementation Method 1
the chemical liquid can remove foreign matters from the surface of the substrate by the etching action of the chemical liquid
Implementation Method 2
the two-fluid jet can wash away the chemical liquid and the removed foreign matters from the surface of the substrate
Data Source
AI summary
Various methods of cleaning a substrate are provided. In one aspect, method of cleaning a substrate, comprising: holding and rotating a substrate by a substrate holder; and supplying a chemical liquid to a chemical liquid nozzle and supplying two fluids to a two-fluid nozzle while moving the chemical-liquid nozzle and the two-fluid nozzle radially outwardly from the center to the periphery of the substrate, wherein the distance of the chemical-liquid nozzle from a rotating axis of the substrate holder is longer than the distance of the two-fluid nozzle from the rotating axis of the substrate holder while the chemical-liquid nozzle and the two-fluid nozzle are moved radially outwardly from the rotating axis of the substrate holder.