Non-Contact Substrate Cleaning Protrusion for Particle Removal
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Solution Overview
Problem
Existing substrate cleaning methods often cause deformation and distortion during the exposing process due to particle presence on the substrate's bottom surface, as traditional brushes can physically damage the substrate while cleaning.
Innovation Solution
A substrate treating apparatus with a cleaning unit featuring a protrusion and a cleaning liquid supply system that allows for non-contact cleaning, using deionized water, ozone water, or hydrogen water to remove particles without direct contact, minimizing damage and ensuring uniform cleaning of the substrate's bottom surface.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a brush contacts the bottom surface of the substrate to remove particles, then cleaning effectiveness is improved, but the substrate bottom surface may be physically damaged
Solution Approach 1:
The patent replaces the mechanical brush contact system with a non-contact cleaning system using a nozzle to supply cleaning liquid onto the substrate bottom surface. The cleaning liquid flows over the surface to remove particles without mechanical contact, thereby eliminating substrate damage while maintaining cleaning effectiveness.
Solution Approach 2:
The patent uses a nozzle to supply cleaning liquid (hydraulic element) onto the substrate bottom surface. The liquid flow carries particles away from the substrate without requiring mechanical contact, resolving the contradiction between effective particle removal and prevention of substrate damage.
2Productivity
If the protrusion is positioned close to the bottom surface for effective cleaning, then cleaning efficiency is improved, but the risk of substrate damage increases
Solution Approach 1:
The protrusion with nozzle replaces direct mechanical contact cleaning with a liquid-based non-contact cleaning system. The nozzle can be positioned close to the substrate bottom surface to ensure complete coverage and high cleaning efficiency, while the liquid flow mechanism inherently prevents mechanical damage to the substrate.
3Productivity
If the cleaning liquid supply hole and protrusion are positioned to overlap for maximum cleaning effect, then cleaning coverage is improved, but liquid waste increases
Solution Approach 1:
The patent positions the cleaning liquid supply hole and protrusion at non-overlapping locations. The hole supplies cleaning liquid to one region while the protrusion directs liquid to another region, ensuring complete coverage of the substrate bottom surface without redundant liquid application, thereby reducing cleaning liquid waste while maintaining effective cleaning coverage.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The apparatus efficiently cleans the substrate's entire bottom surface while minimizing damage, ensuring accurate mounting and reducing distortion during the exposing process.
Implementation Method 1
a cleaning liquid supply unit connected to a hole formed at the body, and supplying a cleaning liquid to the bottom surface
Data Source
AI summary
The inventive concept provides a substrate treating apparatus. The substrate treating apparatus includes a support unit configured to support a substrate; and a cleaning unit configured to clean a bottom surface of the substrate supported on the support unit, and wherein the cleaning unit comprises: a body; and a protrusion formed to be upwardly protruding from the body, and the protrusion is positioned to be spaced apart from the bottom surface.