Substrate Core Hole Assembly for Thin Die Alignment
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Solution Overview
Problem
Manufacturing challenges arise when the thickness of an integrated circuit (IC) die and the substrate core differ, leading to misalignment and reduced yield in IC device package structures, particularly when the die is thinner than the substrate core.
Innovation Solution
A method is employed to align and fix a thinner die within a hole in the substrate core using solder features, eliminating misalignment issues and reducing variations in dielectric material thickness without requiring a sacrificial panel, thereby improving manufacturing yield.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If a thinner die is used in the substrate core, then the device can achieve better electrical performance and smaller size, but misalignment and rotation occur during manufacturing reducing yield
Solution Approach 1:
The patent introduces a sacrificial panel as an intermediary component between the thinner die and the substrate core. This panel provides a stable mounting surface during the bonding process, allowing the die to be properly positioned and bonded without rotating or shifting. After bonding, the sacrificial panel is removed. This intermediary structure enables the use of thinner dies while maintaining manufacturing precision and yield.
2Weight of moving object
If the die thickness is reduced, then the package size and weight are reduced, but the die rotates and shifts during bonding reducing reliability
Solution Approach 1:
The patent employs a sacrificial panel that provides mechanical support and stability during the bonding process. This panel prevents the thinner die from rotating or shifting before the bonding is complete, ensuring reliable attachment to the substrate core. The panel acts as a temporary cushioning structure that is removed after bonding is established.
3Device complexity
If traditional bonding methods are used without a sacrificial panel, then the process is simpler, but misalignment occurs reducing manufacturing precision
Solution Approach 1:
The sacrificial panel serves as a mediator that temporarily supports the die during positioning and bonding. It provides a stable reference surface that enables precise alignment without adding significant complexity to the overall process. The panel is removed after bonding, leaving a clean final structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method ensures proper alignment and fixation of thinner dies, reducing rotation, shifting, and tilting, and results in improved manufacturing yields and reduced thickness variations in dielectric material encapsulation.
Implementation Method 1
a die within the hole coupled to the first metal features by solder features
Data Source
AI summary
An apparatus comprises a substrate core comprising a hole extending from an opening at a first surface of the substrate core to a second surface opposite the first surface. A metal layer is over the first surface. The metal layer comprises a plurality of first metal features over a first portion of the opening. The metal layer also includes a second metal feature extending from a sidewall of the hole and over a second portion of the opening. A die is within the hole and coupled to the first metal features by solder features. The die may comprise a capacitor.