Controlled perovskite grain sizes and rare-earth subcomponents stabilize capacitance across voltage and temperature while reducing leakage current.
Intra-shell pores in core-shell ceramic grains trap oxygen defects, reducing leakage current and improving laminated capacitor insulation reliability.
A perovskite-rocksalt dielectric stack preserves high permittivity while lowering dissipation factor and leakage current in capacitors.
A resistive layer raises ESR in a single-layer capacitor, broadening RF frequency response for shunt use, noise filtering, and miniaturization.
Via-stack electrodes built inside the substrate free surface space and place decoupling closer to the IC for faster charge transfer and stable voltage.
A sidewall conductor links a rear-surface embedded capacitor to a through-hole electrode, preserving element area while reducing noise and improving reliability.
A two-zone dielectric process uses vapor deposition at the pore boundary and anodic oxidation inside to raise capacitance and voltage resistance.
Stoichiometry-tuned amorphous oxide nitride dielectrics keep high permittivity and electrical resistance in capacitor films 400 nm or thinner.
Vertically interlocked in-substrate capacitors raise capacitance near the die, shortening electrical paths and improving power delivery.
Multiple series-coupled capacitor elements average capacitance variation, helping high-frequency filters hold stable resonant frequency.
A graded fluorine profile in the tantalum oxide film preserves high permittivity while suppressing capacitance degradation near the solid electrolyte.
An eave-shaped porous silicon capacitor boosts capacitance without enlarging the chip by keeping micropore openings clear for dielectric and conductor layers.
High crosslink density and elastic modulus help this dielectric resin film capacitor retain capacitance and resist brittle failure at elevated temperatures.
Using strontium and tantalum instead of titanium, niobium, alkali metals, and lead preserves high permittivity, resistivity, and low loss across temperature.