Substrate Position Detection Using Corner Image Sensors
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Solution Overview
Problem
Existing substrate processing devices face challenges in accurately positioning substrates due to warpage or tilt, which can lead to improper plating processes, especially when substrates have intricate patterns or varied materials, and require design modifications for notch-based position detection, making them less efficient and more complex.
Innovation Solution
A substrate processing device equipped with an image sensor to detect the positions of two corners on a diagonal of the substrate, an illuminating device to enhance contrast, and a control system to calculate and correct the center position and rotation angle, allowing for precise positioning and alignment regardless of substrate tolerance or material characteristics.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If a notch-based position detection method is used, then substrate position can be detected, but design modification is required for substrate holders and manufacturing complexity increases
Solution Approach 1:
The patent uses image sensors to capture optical images of substrate corners, creating a visual copy of the substrate position. This eliminates the need for physical notches on substrate holders, as the position information is obtained through optical copying rather than mechanical features.
Solution Approach 2:
The patent replaces the mechanical notch-based detection system with an optical image sensing system. Instead of using physical notches and mechanical sensors, the invention uses image sensors to detect substrate corner positions, substituting mechanical interaction with optical field interaction.
2Measurement precision
If conventional position detection methods are used, then simple substrates can be processed, but substrates with intricate patterns cannot be positioned accurately
Solution Approach 1:
The image sensor captures a visual copy of the substrate corner, allowing position detection without physical contact. This optical copying method works regardless of the substrate's surface patterns, materials, or thickness variations, providing universal applicability across different substrate types.
Solution Approach 2:
The image sensor-based detection system serves multiple functions: it detects substrate position, determines corner locations, and works with various substrate materials and patterns. This universal approach replaces specialized detection methods that were limited to specific substrate types.
3Measurement precision
If multiple detection points are used to improve accuracy, then positioning precision increases, but processing time increases
Solution Approach 1:
The patent extracts only the essential information needed for positioning by detecting just the corner points of the substrate. Rather than analyzing the entire substrate surface or multiple points, the method focuses on extracting corner position data, which is sufficient for accurate positioning while minimizing processing time.
Solution Approach 2:
The patent uses a minimal number of detection points (corner points) rather than comprehensive surface scanning. This partial action approach provides sufficient positioning accuracy without the time cost of complete substrate characterization.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enhances the accuracy of substrate positioning, reduces the need for design modifications, and shortens processing time by effectively handling substrates with intricate patterns and varied materials, improving the overall efficiency of the plating process.
Implementation Method 1
an image sensor configured to detect positions of two corners on at least one diagonal of a substrate
Implementation Method 2
an illuminating device that can be disposed so as to illuminate the two corners of the substrate on an opposite side of the substrate at the predetermined position relative to the image sensor
Implementation Method 3
the control device being configured to change at least either light quantity or wavelength of output light of the illuminating device
Data Source
AI summary
A substrate processing device for processing a substrate, comprising an image sensor configured to detect positions of two corners on at least one diagonal of a substrate when the substrate is transferred to a predetermined position; an illuminating device that can be disposed so as to illuminate the two corners of the substrate on an opposite side of the substrate at the predetermined position relative to the image sensor; and a control device configured to determine the position of the substrate on the basis of the positions of the two corners, which are detected by the image sensor, the control device being configured to be capable of changing at least either light quantity or wavelength of output light of the illuminating device.