Substrate Detachment Mechanism Using Lift Pins and Fluid Ejection
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Solution Overview
Problem
Adhesion between substrates and stages during chemical mechanical polishing operations, especially with large-area substrates, leads to challenges in detachment, risking substrate damage due to increased pressure and heat.
Innovation Solution
A substrate treatment device equipped with a detachment mechanism featuring lift pins and fluid ejection units, where lift pins push the substrate away from the stage and fluid is ejected to assist in detachment, reducing adhesion forces and preventing damage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If pressure and heat are applied during polishing operation, then polishing effectiveness is improved, but adhesion between substrate and stage increases making detachment difficult
Solution Approach 1:
A fluid (water or other detaching agent) is introduced as an intermediary substance between the substrate and stage. The fluid reduces adhesion forces by penetrating the interface, allowing the substrate to be detached smoothly after polishing without direct mechanical pulling that could cause damage.
Solution Approach 2:
The system uses fluid pressure (hydraulic principle) to eject the substrate from the stage. Fluid is supplied through nozzles or channels to build pressure beneath or around the substrate, using this pressure to lift and detach the substrate from the stage surface in a controlled manner.
2Area of moving object
If large-area substrates are used, then display substrate size is improved, but adhesion strength increases proportionally raising breakage risk
Solution Approach 1:
Fluid is introduced as a mediator to reduce the enhanced adhesion forces that scale with substrate area. The fluid penetrates the substrate-stage interface and reduces friction and adhesion, enabling safe detachment of large-area substrates without excessive pulling forces that would cause breakage.
Solution Approach 2:
The system replaces direct mechanical pulling forces with fluid pressure to achieve detachment. Instead of applying mechanical force that could concentrate stress and cause breakage, fluid pressure is distributed across the substrate area, providing a gentler, more uniform detachment force suitable for large-area substrates.
3Ease of operation
If fluid ejection and lift pin pushing are used simultaneously, then detachment smoothness is improved, but system complexity increases
Solution Approach 1:
The system merges two detachment mechanisms - fluid ejection and lift pin pushing - into a coordinated operation. The fluid ejection system and lift pins work together simultaneously, with fluid reducing adhesion while lift pins provide mechanical lifting force, achieving smooth detachment through combined action.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The combined use of lift pins and fluid ejection enables smooth and stable detachment of substrates, minimizing the risk of damage during the process.
Implementation Method 1
a fluid ejection unit that ejects fluid toward substrate in a direction away from the stage
Implementation Method 2
a lift pin that pushes the substrate in a direction away from the stage
Data Source
AI summary
A substrate treatment method performed by a substrate treatment device includes placing a substrate on a stage, treating the substrate placed on the stage; and detaching a treated substrate from a stage. Detaching the treated substrate includes pushing the substrate with a lift pin in a direction away from the stage, and ejecting fluid through a fluid ejection unit onto the substrate in a direction away from the stage.