Substrate Stage Fixation Detection via Heater Power Coupling

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Solution Overview

Problem

In semiconductor processing, if the substrate is not fixed properly on the stage, heat transfer is not uniform, leading to inconsistent processes such as deposition or etching. Existing methods struggle to accurately assess the fixed state of the substrate, especially under varying temperature and pressure conditions.

Innovation Solution

The method involves using a substrate processing apparatus with a plasma induction electrode and a heater, where the fixed state of the substrate is checked by measuring the AC-2 power transferred through the heater and plasma induction electrode, regardless of the type of plasma induction electrode or changes in gas leak.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Measurement precision

If gas leak measurement is used to check substrate fixed state, then the fixed state can be assessed, but the measurement becomes unreliable under varying temperature and pressure conditions

Engineering Contradiction:

Improvesubstrate fixed state assessment accuracyVSAvoidmeasurement reliability under varying conditions

Core Design Contradiction:

Measurement precisionVSReliability

Solution Approach 1:

The patent replaces the mechanical/gas-based leak detection method with an electrical measurement system. By measuring heater voltage at the plasma induction electrode, the system transitions from gas flow-based detection to electrical property-based detection, which is not affected by temperature and pressure variations in the process chamber.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The patent introduces heater voltage measurement as an intermediary parameter to indirectly assess substrate fixation. Instead of directly measuring gas leak or substrate position, the system uses the electrical characteristics of the heater circuit (which change with substrate contact) as a mediator to infer the fixation state, providing a more reliable indirect measurement method.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Reliability

If substrate fixation is checked at high process temperature, then the assessment reflects actual processing conditions, but measurement accuracy deteriorates due to thermal interference

Engineering Contradiction:

Improvefixed state assessment under actual processing conditionsVSAvoidmeasurement accuracy at high temperature

Core Design Contradiction:

ReliabilityVSMeasurement precision

Solution Approach 1:

The patent replaces temperature-sensitive measurement methods with electrical measurement. By using voltage measurement across the heater, which is part of the plasma induction electrode circuit, the system obtains fixation information through electrical properties that remain stable and measurable even at high process temperatures, avoiding thermal interference in the measurement process.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

3Productivity

If RF power is supplied to plasma induction electrode for plasma generation, then substrate processing can be performed, but it interferes with measuring substrate fixed state

Engineering Contradiction:

Improvesubstrate processing capabilityVSAvoidfixed state measurement accuracy

Core Design Contradiction:

ProductivityVSMeasurement precision

Solution Approach 1:

The patent employs periodic measurement of heater voltage at the plasma induction electrode. By measuring the voltage during the plasma generation cycle (when RF power is supplied), the system captures fixation state information that reflects actual processing conditions. The periodic nature of plasma generation and measurement allows both processing and assessment to occur without mutual interference.

Inventive Principle:

Principle #19Periodic action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach allows for accurate and reliable assessment of the substrate's fixed state, even at high process temperatures, ensuring uniform processing without the need to measure gas leak changes.

Implementation Method 1

a heater located in the stage and used to heat the stage

Methodology Applied

Scientific EffectJoule heating: Joule Heating

Implementation Method 2

a plasma induction electrode used to generate plasma and located in the stage, a first power source configured to supply RF power to the plasma induction electrode

Methodology Applied

Scientific EffectElectromagnetic induction: Electromagnetic Induction

Data Source

PatentUS20250046635A1Substrate processing

Publication Date: 2025.02.06 SAMSUNG ELECTRONICS CO LTD

AI summary

A method of processing a substrate includes locating a substrate in a substrate processing apparatus, fixing the substrate in the substrate processing apparatus, processing the substrate, and checking a fixed state of the substrate. The substrate processing apparatus includes a process chamber, a stage supporting the substrate, a plasma induction electrode used to generate plasma and located in the stage, a first power source configured to supply RF power to the plasma induction electrode, a heater located in the stage and used to heat the stage, a second power source configured to supply AC power to the heater, and a monitoring unit electrically connected to the plasma induction electrode. The checking of the fixed state of the substrate includes measuring AC-2 power of the AC power, which is transferred to the monitoring unit through the heater and the plasma induction electrode.