Substrate Fixing Apparatus Support Member Adhesive Uniformity

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Solution Overview

Problem

Existing substrate fixing apparatuses face challenges in achieving uniform temperature characteristics due to uneven thickness of the electrostatic adsorption member and impaired inplane uniformity of the adhesive layer, leading to variations in the adsorption face temperature.

Innovation Solution

The substrate fixing apparatus incorporates a support member with a higher elastic modulus than the adhesive layer, which directly contacts the base plate and electrostatic adsorption member, along with an adhesive layer and heat generating elements, to improve the inplane uniformity of the adhesive layer and achieve uniform temperature characteristics.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If the electrostatic adsorption member is adhesively bonded to the base plate using only an adhesive layer, then the manufacturing process is simple, but the inplane uniformity of the adhesive layer is impaired and temperature variation occurs on the adsorption face

Engineering Contradiction:

Improvemanufacturing process simplicityVSAvoidinplane uniformity of adhesive layer

Core Design Contradiction:

Ease of manufactureVSManufacturing precision

Solution Approach 1:

The patent introduces support members at specific locations beneath the electrostatic adsorption member to provide localized structural support. These support members create local high-points that prevent excessive adhesive compression in critical areas, maintaining uniform adhesive thickness and eliminating temperature variation on the adsorption face while preserving the simplicity of the adhesive bonding process

Inventive Principle:

Principle #3Local quality

2Device complexity

If the electrostatic adsorption member is placed directly on the base plate without support members, then the device structure is simple, but uneven thickness of the electrostatic adsorption member causes impaired inplane uniformity of the adhesive layer

Engineering Contradiction:

Improvedevice structureVSAvoidinplane uniformity of adhesive layer

Core Design Contradiction:

Device complexityVSManufacturing precision

Solution Approach 1:

The support members act as intermediary elements between the base plate and the electrostatic adsorption member. These intermediaries provide mechanical support and maintain proper spacing, ensuring that the adhesive layer achieves uniform thickness during bonding without requiring complex device structures or additional manufacturing steps

Inventive Principle:

Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration enhances the inplane uniformity of the adhesive layer and suppresses temperature variations on the adsorption face, resulting in improved uniform temperature characteristics and effective substrate retention.

Implementation Method 1

an adhesive layer that adhesively bonds the electrostatic adsorption member to the base plate

Methodology Applied

Scientific EffectAdhesive bonding: Adhesive

Implementation Method 2

An elastic modulus of the support member is higher than an elastic modulus of the adhesive layer

Methodology Applied

Scientific EffectElastic modulus difference: Elasticity

Implementation Method 3

an electrostatic adsorption member that adsorbs and retains a substrate

Methodology Applied

Scientific EffectElectrostatic adsorption: Electrostatics

Data Source

PatentUS11456200B2Substrate fixing apparatus including a base plate, an electrostatic adsorption member, a plurality of support members on the base plate and supporting the electrostatic adsorption member, and an adhesive layer bonding the electrostatic adsorption member to the base plate

Publication Date: 2022.09.27 SHINKO ELECTRIC IND CO LTD

AI summary

A substrate fixing apparatus includes: a base plate; an electrostatic adsorption member that adsorbs and retains a substrate; a support member that is disposed on the base plate to support the electrostatic adsorption member; and an adhesive layer that adhesively bonds the electrostatic adsorption member to the base plate. The support member directly contacts the base plate and the electrostatic adsorption member. An elastic modulus of the support member is higher than an elastic modulus of the adhesive layer.