Substrate-Free LED Chip Assembly Without Wire Bonding
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Solution Overview
Problem
Existing LED display devices face challenges in miniaturization due to the space occupied by wire bonding and the high manufacturing costs associated with precise alignment and dimensioning required in flip-chip techniques.
Innovation Solution
A substrate-free LED device design featuring LED chips with an electric circuit layer assembly and encapsulating layer, where the LED chips are connected through an electric circuit layer assembly without wire bonding, allowing for precise electrical interconnection and reduced device size.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If wire bonding is used to connect LED chips to electrodes, then electrical connection is achieved, but the device size increases due to space occupation by wire bonding structure
Solution Approach 1:
The patent removes the wire bonding structure from the LED device by using a substrate-free design where LED chips are directly mounted on the circuit board and connected through conductive paste, eliminating the space-occupying wire bonding components while maintaining electrical connection functionality
Solution Approach 2:
The patent transitions from three-dimensional wire bonding connections to two-dimensional planar conductive paste connections on the circuit board, reducing the vertical space occupation and overall device volume while achieving the same electrical interconnection function
2Volume of moving object
If flip-chip technique is used to bond LED chips to conductive traces, then device dimension is reduced, but manufacturing cost increases due to requirements for accurate dimension, position, and highly precise alignment
Solution Approach 1:
The patent replaces the expensive and complex flip-chip bonding process with a simpler, more cost-effective conductive paste mounting method that uses readily available materials and processes, achieving similar miniaturization benefits without the high manufacturing costs associated with precise alignment requirements
Solution Approach 2:
The patent changes the bonding method from mechanical flip-chip bonding requiring precise dimensional and positional parameters to a more tolerant conductive paste application process, significantly reducing manufacturing complexity and cost while maintaining reduced device dimensions
3Volume of moving object
If substrate-free design is used with LED chips mounted directly on circuit board, then device size is reduced and light exit surface area is enhanced, but manufacturing precision requirements increase
Solution Approach 1:
The patent removes the intermediate substrate layer between LED chips and circuit board, creating a direct mounting configuration that reduces overall device size and increases the proportion of light exit surface area, while using conductive paste to simplify alignment requirements compared to traditional substrate-based mounting
Data Source
AI summary
A LED device includes multiple LED chips each including opposite first and second surfaces, a side surface, and an electrode assembly disposed on the second surface and including first and second electrodes. The first surface of each of the LED chips is a light exit surface. The LED device further includes an electric circuit layer assembly disposed on the second surfaces of the LED chips and having opposite first and second surfaces and a side surface. The first surface is electrically connected to the first and second electrodes. The LED device further includes an encapsulating layer enclosing the LED chips and the electric circuit layer assembly to expose the second surface of the electric circuit layer assembly.