Multilayer Ceramic Substrate Ground Conductor Heat Dissipation
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Solution Overview
Problem
Existing electronic devices using radio frequency with high-power amplifiers face challenges in effectively discharging heat, leading to insufficient reliability, manufacturing yield, and electric characteristics.
Innovation Solution
The electronic device incorporates a metal member with high heat conductivity, integrated into the substrate as both a ground conductor and radiator, with a multilayer ceramic substrate and specific connection patterns to enhance heat dissipation and mechanical strength, while maintaining reliability and yield.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a metal member is provided in an opening formed in the substrate to discharge heat, then heat dissipation is improved, but reliability and manufacturing yield are insufficient
Solution Approach 1:
The patent merges the ground conductor and radiator functions into a single integrated structure. The bottom surface of the opening is formed as a continuous conductive surface that serves both as ground reference and heat dissipation path, eliminating the need for separate components and improving reliability through structural integration.
Solution Approach 2:
The bottom surface of the opening performs multiple functions simultaneously: it acts as a ground conductor for electrical reference, a radiator for heat dissipation from the amplifier, and a mechanical support structure. This multi-functionality improves reliability by reducing component count and potential failure points.
2Temperature
If a metal member is provided in an opening formed in the substrate to discharge heat, then heat dissipation is improved, but manufacturing yield is insufficient
Solution Approach 1:
The ground conductor and radiator are merged into a single integrated structure formed as the bottom surface of the opening. This integration simplifies the manufacturing process by reducing the number of separate components that need to be assembled, thereby improving manufacturing yield.
Solution Approach 2:
The bottom surface of the opening is formed as a ground conductor and radiator structure during the substrate fabrication process itself, before the amplifier is mounted. This preliminary formation of the multi-functional structure simplifies subsequent assembly steps and improves manufacturing yield.
3Reliability
If the ground conductor and radiator are integrated, then electric characteristics are improved, but structural complexity increases
Solution Approach 1:
The ground conductor and radiator are merged into a single integrated structure forming the bottom surface of the opening. This merging improves electric characteristics by providing a solid ground reference close to the amplifier while simultaneously serving as a heat dissipation path, without requiring additional complex structural elements.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration improves electric characteristics by increasing bandwidth and reducing transmission loss without compromising reliability or manufacturing yield, ensuring effective heat dissipation and mechanical integrity.
Implementation Method 1
a metal member which has a certain heat conductivity and functions as a ground conductor and a radiator
Data Source
Figure 1A~1B
Figure 2A~2B
Figure 3A~3B
AI summary
An electronic device including a first ground conductor layer positioned at an underside of a first insulation layer; a second ground conductor layer positioned at an upper side of the first insulation layer; a second insulation layer positioned at an upper side of the second ground conductor layer; a first connection pattern formed in inside wall of a first opening penetrating the first insulation layer and the second insulation layer and interconnecting the first ground conductor layer and the second ground conductor layer; a conductive member provided in the first opening and connected to the first ground conductor layer; and an electronic element mounted on the member and grounded to the member.