Substrate Handler for Vertical Cleaning Orientation Change
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Solution Overview
Problem
The challenge in semiconductor device manufacturing is efficiently transferring substrates between cleaning chambers with different orientations, which increases air exposure time and contamination risk due to limited space and the need for precise orientation changes, particularly during the final transfer from a vertically oriented chamber to a horizontally oriented chamber.
Innovation Solution
A substrate cleaning system with integrated modules for pre-cleaning, vertical cleaning, and integrated cleaning and drying, utilizing a substrate handler to transfer substrates between these modules while maintaining orientation changes, reducing the footprint and transfer time, and employing blade assemblies with actuators to rotate and position substrates accurately.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If substrates are transferred between cleaning chambers with different orientations, then cleaning effectiveness is improved, but air exposure time increases and contamination risk increases
Solution Approach 1:
The patent implements nested cleaning chambers where a second cleaning chamber is positioned inside the first cleaning chamber. This allows substrates to undergo cleaning processes in different orientations without requiring external transfers, thereby minimizing air exposure time while maintaining cleaning effectiveness. The nested configuration enables the substrate to remain within a controlled environment throughout the cleaning process.
2Loss of time
If cleaning chambers are arranged closely together, then air exposure time is reduced, but space for substrate manipulation and orientation change is limited
Solution Approach 1:
The patent utilizes vertical positioning of cleaning chambers at different heights rather than horizontal arrangement. The first cleaning chamber is positioned at a first vertical position and the second cleaning chamber at a second vertical position, allowing substrates to be transferred between orientations in the vertical dimension. This dimensional approach provides adequate space for substrate manipulation and orientation changes while keeping the chambers closely arranged to minimize air exposure time.
3Adaptability or versatility
If substrate orientation is changed during transfer, then cleaning process adaptability is improved, but device complexity increases
Solution Approach 1:
The patent employs a blade assembly as an intermediary mechanism to facilitate substrate orientation changes. The blade assembly includes a blade that contacts the substrate and works in conjunction with a rotation actuator to change the substrate's orientation from horizontal to vertical or vice versa. This intermediary approach enables adaptable cleaning processes while managing device complexity through a focused, dedicated mechanism rather than a complex multi-functional system.
4Reliability
If multiple cleaning chambers are used, then cleaning thoroughness is improved, but footprint of the cleaning enclosure increases
Solution Approach 1:
The patent implements a nested configuration where the second cleaning chamber is positioned inside the first cleaning chamber. This nesting arrangement allows multiple cleaning chambers to be utilized for thorough cleaning processes while minimizing the overall footprint of the cleaning enclosure. The nested design enables compact integration of multiple cleaning stages without requiring proportional increases in enclosure area.
Solution Approach 2:
The patent utilizes vertical arrangement of cleaning chambers at different vertical positions to reduce horizontal footprint. By positioning the first cleaning chamber at a first vertical position and the second cleaning chamber at a second vertical position, the system accommodates multiple cleaning chambers within a smaller horizontal area, thereby reducing the overall footprint while maintaining cleaning thoroughness.
Data Source
AI summary
Embodiments described herein generally relate to equipment used in the manufacturing of electronic devices, and more particularly, to a cleaning system, cleaning system hardware and related methods which may be used to transport and clean the surface of a substrate. According to one embodiment, a blade handling assembly for handling a substrate in a cleaning system includes a gripping assembly including a pair of gripping blades, the blades operable with a gripping actuator to hold a substrate at its edges. The assembly includes a first blade actuator for moving the gripping assembly and substrate between a horizontal and a vertical orientation utilizing a first axis. The assembly includes a second blade actuator for moving the vertically oriented gripping assembly and substrate 180 degrees utilizing a second axis, thereby causing the substrate to face an opposite direction. Movement utilizing the first axis results in rotation of the first and second blade actuators and movement utilizing the second axis results in rotation of only the second blade actuator.