Modular Substrate Handling Chamber Layout for Higher Throughput

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Solution Overview

Problem

Conventional semiconductor production systems have limitations in reducing manufacturing costs and processing time while improving manufacturing efficiency, particularly in substrate processing systems with limited substrate handling and processing capabilities.

Innovation Solution

The introduction of an inboard substrate handling chamber and an outboard substrate handling chamber interconnected by an additional outboard load-lock module, which increases the number of substrate processing chambers and capabilities by providing a more complex and modular substrate processing system with oblique facets and interchangeable load-lock modules.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If conventional substrate processing systems with limited chambers are used, then device complexity is reduced, but substrate processing efficiency and manufacturing productivity are limited

Engineering Contradiction:
Improvesubstrate processing efficiencyVSAvoidsystem complexity
Core Design Contradiction:
ProductivityVSDevice complexity

Solution Approach 1:

The substrate processing system is divided into multiple independent chambers (first substrate processing chamber, second substrate processing chamber, third substrate processing chamber) that can be connected through substrate handling chambers. Each chamber can perform specific processing functions independently, allowing the system to achieve high productivity through modular expansion without requiring complete system redesign.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The substrate handling chambers serve multiple functions: they act as transfer stations between processing chambers, provide additional processing capability themselves, and can be configured to connect different processing chambers in various arrangements. This multi-functionality allows the system to maintain versatility while increasing overall processing capacity.

Inventive Principle:
Principle #6Universality (Multi-functionality)

2Productivity

If additional substrate processing chambers are added to increase processing capabilities, then manufacturing productivity improves, but device complexity and cost increase

Engineering Contradiction:
Improvemanufacturing efficiencyVSAvoidsystem complexity
Core Design Contradiction:
ProductivityVSDevice complexity

Solution Approach 1:

The system uses multiple discrete substrate processing chambers that can be independently configured and connected through substrate handling chambers. This segmentation allows incremental expansion of processing capacity by adding chambers as needed, rather than requiring a complete system overhaul, thereby improving productivity while managing complexity through modular design.

Inventive Principle:
Principle #1Segmentation

3Loss of time

If a single substrate handling chamber is used, then device complexity is minimized, but processing time and substrate handling efficiency are limited

Engineering Contradiction:
Improveprocessing timeVSAvoidsystem complexity
Core Design Contradiction:
Loss of timeVSDevice complexity

Solution Approach 1:

The substrate handling function is divided into multiple separate substrate handling chambers that can operate in parallel or sequence. This allows substrates to be transferred between processing chambers simultaneously through different handling chambers, reducing overall processing time while maintaining manageable system complexity through modular architecture.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

Substrate handling chambers serve as intermediary stations between substrate processing chambers, enabling efficient substrate transfer without requiring direct connections between all processing chambers. This intermediary approach reduces processing time by providing dedicated transfer pathways while keeping system complexity manageable through standardized interface designs.

Inventive Principle:
Principle #24Intermediary (Mediator)

Data Source

PatentUS20250006521A1Extended substrate processing systems and methods with additional processing chamber connectability
Publication Date: 2025.01.02 ASM IP HLDG BV
  • US20250006521A1 patent drawing
  • US20250006521A1 patent drawing
  • US20250006521A1 patent drawing

AI summary

Substrate processing systems have expanded substrate processing capabilities. In some examples, this may be accomplished by providing an inboard substrate handling chamber (e.g., with six facets or side walls) and an outboard substrate handling chamber (e.g., with five facets or side walls). The inboard substrate handling chamber may be connected with additional substrate processing chambers. The inboard substrate handling chamber may be connected to the outboard substrate handling chamber by an additional outboard load-lock module. These features enable a manufacturer to increase the number of substrate processing chambers in a substrate processing system or line.