Support Substrate Heat Transfer Elements for IC Thermal Management
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Solution Overview
Problem
Existing electronic devices with IC chips face challenges in effectively transferring heat from the chips to support substrates without compromising electrical connections.
Innovation Solution
A support substrate with a metal heat transfer layer and protruding heat transfer elements embedded in an adhesive layer, allowing for enhanced heat transfer between the chip and substrate while maintaining electrical isolation, combined with an integrated network of electrical connections and an encapsulation block for the chip and wires.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a metal heat transfer layer is added to the support substrate, then heat transfer efficiency is improved, but device complexity increases
Solution Approach 1:
The heat transfer function is segmented from the electrical connection function. The metal heat transfer layer with protruding elements is separated as a dedicated thermal management component, while electrical connections are handled by separate conductive paths. This segmentation allows optimization of heat transfer without compromising electrical functionality and reduces interference between thermal and electrical systems.
Solution Approach 2:
The protruding metal heat transfer elements act as intermediaries between the IC chip and the support substrate. These elements extend into the adhesive layer to create enhanced thermal contact area, mediating the heat transfer process while the adhesive material provides both mechanical bonding and thermal conduction pathways.
2Temperature
If protruding heat transfer elements are embedded in the adhesive layer, then heat transfer area is increased, but manufacturing precision requirements increase
Solution Approach 1:
The protruding heat transfer elements are pre-formed and positioned on the support substrate before the adhesive layer is applied. This preliminary positioning ensures accurate alignment with the IC chip's thermal interface, and the subsequent adhesive application locks them in place without requiring high-precision alignment during the bonding process.
Solution Approach 2:
The adhesive material's viscosity and curing characteristics are optimized to allow the protruding elements to be properly embedded and positioned. The adhesive provides sufficient flow to accommodate the protruding elements while maintaining stable bonding, reducing the precision requirements for element placement.
3Reliability
If the metal heat transfer layer is electrically isolated from the chip, then electrical interference is reduced, but heat transfer efficiency may decrease
Solution Approach 1:
The support substrate is designed with spatially differentiated properties: the metal heat transfer layer provides thermal conduction, while the adhesive material and encapsulation provide electrical isolation. The protruding elements create localized thermal contact zones that are electrically isolated by the adhesive, achieving both thermal efficiency and electrical separation in different spatial regions.
Solution Approach 2:
The system uses composite material structures combining metal (for heat transfer), adhesive material (for electrical isolation and bonding), and encapsulation blocks. This composite approach allows simultaneous achievement of thermal conduction and electrical isolation by selecting materials with appropriate properties for each function.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration significantly increases heat transfer efficiency between the IC chip and the support substrate while maintaining electrical connectivity, ensuring effective thermal management without electrical interference.
Implementation Method 1
The support substrate includes a metal heat transfer layer on the side of its mounting face, opposite the chip... The electronic device further comprises a plurality of metal heat transfer elements disposed in the holes of the metal layer of the support substrate and extending protruding, relative to the mounting face of the support substrate, into the layer of adhesive material... Thus, the transfers of heat between the chip and the support substrate are increased.
Data Source
AI summary
A support substrate has a mounting face with a metal heat transfer layer. Holes are provided to extend at least partially through the metal heat transfer layer. Metal heat transfer elements are disposed in the holes of the metal heat transfer layer of the support substrate. An electronic integrated circuit (IC) chip has a rear face that is fixed to the mounting face of the support substrate via a layer of adhesive material. The metal heat transfer elements disposed in the holes of the metal layer of the support substrate extend to protrude, relative to the mounting face of the support substrate, into the layer of adhesive material.