Substrate Heater with Cooling Jacket for Thermal Shock Resistance
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Solution Overview
Problem
Existing substrate heating devices face challenges in achieving precise temperature control and are prone to thermal shock damage when heating substrates to high temperatures, particularly due to the use of materials like aluminum nitride which have low thermal shock resistance.
Innovation Solution
A substrate heating device with a substrate heater made of free-cutting ceramics, embedded with a resistance heating element and an electrostatic chuck, and covered by a jacket with a cooling gas supplier to manage temperature through a cooling space, enhancing thermal shock resistance and controllability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If aluminum nitride is used as substrate stage material, then thermal conductivity is improved, but thermal shock resistance deteriorates
Solution Approach 1:
The substrate stage is constructed as a composite structure combining aluminum nitride (high thermal conductivity) with a shaft portion made of different material (improved thermal shock resistance). This composite approach allows each material to contribute its superior properties to the overall system, resolving the contradiction between thermal conductivity and thermal shock resistance.
2Productivity
If substrate is heated to high temperatures, then processing efficiency is improved, but thermal shock damage risk increases
Solution Approach 1:
The shaft portion is designed with material and structural characteristics that provide beforehand cushioning against thermal shock. By preparing the shaft with appropriate material properties before the heating process begins, the system can withstand thermal shock damage when the substrate is heated to high temperatures for efficient processing.
3Device complexity
If conventional heating structure is used, then device simplicity is maintained, but temperature control precision deteriorates
Solution Approach 1:
The heating device is segmented into distinct functional portions: a substrate stage for holding the substrate, a shaft portion for structural support and thermal management, and a heater embedded within. This segmentation allows each component to be optimized for its specific function while maintaining overall structural simplicity, thereby improving temperature control precision without excessive complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides improved temperature controllability and reduced risk of thermal shock damage, allowing for efficient heating of substrates up to 300 degrees C or higher while maintaining manufacturing cost-effectiveness and ease of processing.
Implementation Method 1
a substrate heater (10) including a placement surface (11) on which the substrate W is placed, and configured to heat the substrate W placed on the placement surface (11) using a heater (12)
Implementation Method 2
a jacket (20) provided to cover a bottom portion of the substrate heater (10) via a cooling space (30), and a cooling gas supplier (31) configured to supply a cooling gas to the cooling space (30)
Data Source
AI summary
According to embodiments of the present disclosure, a substrate heating device, a substrate heating method, and a method of manufacturing a substrate heater are provided. A substrate heating device for heating a substrate within a processing container configured to perform processing of a substrate therein includes a substrate heater including a placement surface on which the substrate is placed. The substrate heater is configured to heat the substrate placed on the placement surface using a heater. The substrate heating device further includes a jacket provided to cover a bottom portion of the substrate heater via a cooling space and a cooling gas supplier configured to supply a cooling gas to the cooling space.