Substrate Heating Apparatus Cooling Plate Heat Pipe Fin Structure
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Solution Overview
Problem
Existing substrate heating apparatuses face challenges with cooling mechanisms that are complex, prone to leakage, and limit layout design flexibility due to the use of cooling liquid tubes and air-cooled fins, which increase the size of the apparatus and risk contamination of the substrate and internal atmosphere.
Innovation Solution
A heating apparatus with a cooling plate integrated with heat pipes and a fin structure, where the cooling plate moves between positions to transfer heat to the fin structure, and a suction system is used to cool the fin structure through gas flow, eliminating the need for cooling liquid tubes and reducing the apparatus size.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If cooling liquid tubes are used to cool the substrate, then cooling function is achieved, but the structure becomes complex and leakage risk increases
Solution Approach 1:
The patent extracts the cooling liquid tubes from the heating apparatus, removing the source of leakage and structural complexity. The cooling function is achieved through an external cooling plate that contacts the substrate directly, eliminating the need for internal cooling channels and liquid circulation systems.
Solution Approach 2:
The patent replaces the mechanical cooling liquid circulation system with a direct thermal contact system using a cooling plate. This substitution eliminates complex piping, pumps, and liquid flow control mechanisms while maintaining effective cooling through phase change materials or direct thermal conduction.
2Reliability
If air-cooled fins are used for cooling, then cooling efficiency is improved, but the apparatus size increases and layout design flexibility is limited
Solution Approach 1:
The patent extracts the air-cooled fins from the heating apparatus, removing the space-consuming thermal management component. The cooling function is transferred to an external cooling plate that can be positioned close to the substrate without requiring large internal volumes for fin structures.
Solution Approach 2:
The patent moves the cooling function from a three-dimensional internal structure (fins requiring vertical and horizontal space) to a two-dimensional surface contact system (cooling plate contacting substrate surface), reducing the volume occupation while maintaining cooling effectiveness through increased surface area contact.
3Reliability
If cooling liquid tubes meandering through the heating apparatus are used, then cooling function is achieved, but the freedom of layout design is greatly limited
Solution Approach 1:
The patent extracts the meandering cooling liquid tubes from the heating apparatus, completely removing the constraint they impose on layout design. The cooling plate can be positioned independently without needing to accommodate tube routing, allowing optimal placement for thermal management and mechanical design freedom.
4Reliability
If cooling liquid tubes are used, then cooling is achieved, but maintenance becomes troublesome
Solution Approach 1:
The patent extracts the cooling liquid tubes and associated circulation system from the heating apparatus, eliminating components that require maintenance such as pump seals, tube joints, and liquid filtration systems. The simplified cooling plate design has no moving parts or fluid pathways, making it maintenance-free.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution simplifies the structure, reduces the risk of leakage, enhances layout design flexibility, and minimizes the risk of substrate contamination while maintaining effective cooling, resulting in a more compact and efficient heating apparatus.
Implementation Method 1
a heat pipe having a first end connected to the cooling plate, and a second end
Implementation Method 2
a first suction passage having a suction port opening into a space in the casing such that the suction port is located adjacent to the fin structure when the cooling plate is in the first position, whereby the cooling plate is cooled through the heat pipe when a gas in the casing is suctioned through the suction port
Data Source
AI summary
Disclosed is a substrate heating apparatus including a hot plate that heats a substrate, and a cooling plate that supports the substrate and moves between a first position (home position) and the second position above the hot plate to transfer wafers between the two positions. A heat-radiating fin structure is connected to the cooling plate to move together with the cooling plate. The fin structure is thermally connected to the cooling plate via heat pipes. A suction port is arranged so as to locate adjacent to the fin structure when the cooling plate is in the home position. The fin structure is cooled by a gas passing therethrough before flown into the suction port, whereby the cooling plate is cooled through heat transfer from the cooling plate to the fin structure through the heat pipes.