Substrate Holder Recess Absorbs Lid Pressure to Stop Leakage

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

Gas leakage in multiple reactor apparatuses used in semiconductor manufacturing leads to process disruptions and equipment degradation due to deformation of the outer chamber's top lid, causing unstable contact between reactor walls and substrate holders.

Innovation Solution

A substrate holder with a stepped portion and recess region, allowing for elastic behavior when pressure is applied, which forms a buffer to absorb pressure and prevent gas leakage, and optionally includes props with a lower thermal expansion coefficient to maintain structural integrity at high temperatures.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If multiple reactor apparatuses are used to increase throughput, then productivity is improved, but gas leakage occurs due to top lid deformation

Engineering Contradiction:
ImprovethroughputVSAvoidprocess stability
Core Design Contradiction:
ProductivityVSReliability

Solution Approach 1:

The substrate holder incorporates a recess region that acts as a buffer to absorb pressure from the top lid before it can cause deformation and gas leakage. This preemptive cushioning structure prevents the harmful effects of pressure accumulation while maintaining the multiple reactor configuration for high throughput production

Inventive Principle:
Principle #11Beforehand cushioning (Prior cushioning)

2Strength

If the top lid is made heavier to strengthen the outer chamber, then structural strength is improved, but deformation of the outer chamber increases

Engineering Contradiction:
Improveouter chamber strengthVSAvoidouter chamber deformation
Core Design Contradiction:
StrengthVSShape

Solution Approach 1:

The recess region in the substrate holder serves as a buffer that absorbs the pressure from the heavy top lid before it can deform the outer chamber. This allows the use of a stronger, heavier top lid to maintain structural integrity without causing the deformation that would lead to gas leakage

Inventive Principle:
Principle #11Beforehand cushioning (Prior cushioning)

Solution Approach 2:

The recess region acts as an intermediary buffer zone between the heavy top lid and the outer chamber wall. It mediates the pressure transmission, allowing the top lid to be sufficiently heavy for strength while preventing the deformation that would compromise the outer chamber shape

Inventive Principle:
Principle #24Intermediary (Mediator)

3Stability of the object's composition

If the substrate holder is made rigid to maintain contact stability, then contact stability is improved, but adaptability to pressure variations decreases

Engineering Contradiction:
Improvecontact stabilityVSAvoidpressure adaptation
Core Design Contradiction:
Stability of the object's compositionVSAdaptability or versatility

Solution Approach 1:

The substrate holder employs local quality differentiation: the majority of the structure maintains rigidity for stable contact, while the recess region provides localized flexibility to adapt to pressure variations. This allows the holder to be both stable and adaptable simultaneously

Inventive Principle:
Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Significantly reduces gas leakage rates, maintaining process stability at various temperatures and preventing equipment degradation, ensuring consistent thin film deposition quality.

Implementation Method 1

the contact region has an elastic behavior when pressure is applied thereto from the reactor wall during the face-sealing contact

Methodology Applied
Scientific EffectElastic behavior: Elasticity

Implementation Method 2

props with a lower thermal expansion coefficient to maintain structural integrity at high temperatures

Methodology Applied
Scientific EffectThermal expansion: Thermal Expansion

Data Source

PatentUS10738381B2Thin film deposition apparatus
Publication Date: 2020.08.11 ASM IP HLDG BV
  • US10738381B2 patent drawing
  • US10738381B2 patent drawing
  • US10738381B2 patent drawing

AI summary

Disclosed are a substrate holder and a semiconductor manufacturing apparatus including the substrate holder. The substrate holder provides a reaction region by making face-sealing contact with a reactor wall. The substrate holder has an elastic behavior when pressure is applied thereto while the substrate holder makes face-sealing contact with the reactor wall. The semiconductor manufacturing apparatus includes the substrate holder and a gas supply unit configured to supply gas to the reaction region provided by the reactor wall and the substrate holder.