Multi-layer substrate via insulating layer openings
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conductive paste ejection during the heat pressing process in multi-layer substrate manufacturing leads to unnecessary capacitance and short circuits due to gas generation, making it difficult to achieve predetermined electrical characteristics.
Innovation Solution
A multi-layer substrate configuration with an insulating layer having openings around the joining surfaces of interlayer connection conductors, made of insulating resin with higher gas permeability than the base material layers, reduces paste ejection by allowing gas escape and maintaining sticking forces between layers, while using conductive paste with Sn for low melting point reduction.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conductive paste is used to form interlayer connection conductors during heat pressing, then interlayer connection is achieved, but gas generation causes conductive paste ejection leading to short circuits and unnecessary capacitance
Solution Approach 1:
The patent extracts the harmful gas generated during heat pressing by providing escape paths through the insulating layer. The gas is removed from the confined space between base material layers, preventing pressure buildup that would cause conductive paste ejection, while the interlayer connection conductors maintain their electrical connection function.
Solution Approach 2:
The insulating layer acts as an intermediary element between the base material layers. It provides a controlled interface with openings that mediate the heat pressing process by allowing gas escape while maintaining the structural integrity and electrical insulation between layers, preventing direct contact between ejected paste and adjacent conductors.
2Object-generated harmful factors
If the insulating layer is made highly permeable to allow gas escape, then conductive paste ejection is reduced, but sticking force between layers may be compromised
Solution Approach 1:
The insulating layer exhibits local quality variation with different permeability characteristics in different regions. The openings are strategically positioned to provide gas escape paths, while the surrounding insulating material maintains sufficient density and adhesion to ensure strong sticking force between layers. This localized differentiation allows simultaneous achievement of gas permeability and bonding strength.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reduces conductive paste ejection, preventing short circuits and unnecessary capacitance, and achieving desired electrical characteristics by allowing gas escape and maintaining structural integrity.
Implementation Method 1
the insulating layer has greater permeability to gas than that of the first base material layer and the second base material layer
Implementation Method 2
an interlayer connection conductor formed by solidifying conductive paste
Data Source
AI summary
A multi-layer substrate includes a first base material layer made of an insulating material, a first interlayer connection conductor provided in the first base material layer, an insulating layer, a second base material layer made of an insulating material and facing the first base material layer across the insulating layer, and a second interlayer connection conductor provided in the second base material layer and joined with the first interlayer connection conductor. The insulating layer is made of an insulation sheet on which no conductor pattern is provided. The insulation sheet includes an opening around a joining surface between the first interlayer connection conductor and the second interlayer connection conductor. The first interlayer connection conductor and the second interlayer connection conductor are joined with each other through the opening.