Substrate With Built-In Electronic Component Via Laser Cavity

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Solution Overview

Problem

Existing methods for manufacturing substrates with built-in electronic components face challenges in ensuring high reliability and fine pitch pad formation due to gaps formed during the de-smearing process after laser cutting, which can reduce the reliability of the conductor patterns.

Innovation Solution

The method involves forming multiple resin insulating layers and conductor layers, using laser processing to create cavities and via conductors, and applying a de-smearing process to maintain layer integrity, followed by plating to connect electronic components with high precision, ensuring no gaps are formed between resin insulating layers and conductor patterns.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If laser cutting is used to form a cavity through resin insulating layers, then the cavity can be precisely formed to accommodate the electronic component, but gaps are formed between the resin insulating layers and conductor patterns during the de-smearing process, reducing wiring pattern reliability

Engineering Contradiction:

Improvecavity formation precisionVSAvoidwiring pattern reliability

Core Design Contradiction:

Manufacturing precisionVSReliability

Solution Approach 1:

The conductor pattern is formed on the resin insulating layer before the de-smearing process. By preparing the conductor pattern in advance on the laminated resin structure, the pattern is protected from damage during subsequent cavity formation and de-smearing operations, preventing gaps between resin layers and conductor patterns

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The resin insulating layer acts as a protective cushion that covers and protects the conductor pattern during the laser cutting and de-smearing processes. This beforehand protection prevents the harmful separation or gap formation between resin layers and conductor patterns, ensuring wiring pattern reliability

Inventive Principle:

Principle #11Beforehand cushioning (Prior cushioning)

2Reliability

If multiple resin insulating layers are laminated with conductor layers to achieve high-reliability fine-pitched pad formation, then wiring pattern reliability is improved, but the manufacturing process complexity increases

Engineering Contradiction:

Improvewiring pattern reliabilityVSAvoidmanufacturing process complexity

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

Multiple resin insulating layers and conductor layers are laminated together to form an integrated multi-layer structure. This merging of layers creates a robust construction where conductor patterns are embedded within and protected by the resin layers, achieving high reliability for fine-pitched pads while maintaining process efficiency through combined layer formation

Inventive Principle:

Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach enhances the reliability and allows for the formation of finely pitched pads on the built-in electronic components, preventing cracks and ensuring reliable connections between the electronic component and the substrate.

Implementation Method 1

irradiating laser upon the third resin insulating layer such that a cavity is formed through the third resin insulating layer and the second resin insulating layer

Methodology Applied

Scientific EffectLaser ablation: Laser Ablation

Implementation Method 2

plating the second via opening and the third via opening such that a second via conductor having filled plating is formed in the second via opening and a third via conductor having filled plating is formed in the third via opening

Methodology Applied

Scientific EffectElectroplating: Electroplating

Data Source

PatentUS9288910B2Substrate with built-in electronic component and method for manufacturing substrate with built-in electronic component

Publication Date: 2016.03.15 IBIDEN CO LTD

AI summary

A substrate with a built-in electronic component includes multiple resin insulating layers including first, second, third and fourth insulating layers, multiple conductor layers including a first wiring layer including a first pad, a second wiring layer including a second pad, and a third wiring layer including third and fourth pads, multiple via conductors including a first via connecting the first and second pads through the second insulating layer, a second via connecting the second and third pads through the third and fourth insulating layers, and a third via connected to the fourth pad through the fourth insulating layer, and an electronic component positioned a cavity through the second and third insulating layers such that the third via is connecting terminal of the component and fourth pad. The second and third vias have filled plating filling opening portions through the third and fourth insulating layers and through the fourth insulating layer.