Substrate Thickness Control via Laser-Formed Hole Regions
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Solution Overview
Problem
Existing substrate processing methods face challenges such as damage, unstable grinding, and high costs due to the difficulty in grinding materials like glass, silicon, and nitride semiconductors, leading to reduced equipment lifespan and increased processing costs.
Innovation Solution
A method involving the application of a pulsed laser beam to form hole regions on the substrate's surface, reducing its strength and facilitating efficient grinding, while also self-sharpening the grinding tools and preventing surface burning.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional grinding is applied to difficult-to-grind materials, then substrate thickness can be adjusted, but substrate damage occurs and grinding stability deteriorates
Solution Approach 1:
The method applies preliminary action by forming hole regions in the substrate before the grinding step. These pre-formed holes reduce the overall strength of the substrate, making it more compliant and easier to grind without causing damage or instability during the subsequent thickness adjustment process.
Solution Approach 2:
The method changes the physical parameters of the substrate by creating modified regions with altered structural properties. The hole regions change the substrate's mechanical parameters (strength, stiffness) in controlled areas, enabling successful grinding of previously difficult-to-process materials while maintaining thickness precision.
2Manufacturing precision
If conventional grinding is applied to difficult-to-grind materials, then substrate thickness can be adjusted, but processing speed decreases and process stability becomes unstable
Solution Approach 1:
By pre-forming hole regions before grinding, the substrate's grindability is improved in advance. This preliminary modification allows the grinding process to proceed faster and more smoothly, increasing productivity while maintaining the precision of thickness control that would otherwise be compromised by slow, unstable grinding of difficult materials.
3Manufacturing precision
If conventional grinding is applied to difficult-to-grind materials, then substrate thickness can be adjusted, but grinding tool wear increases and equipment lifespan reduces
Solution Approach 1:
The preliminary formation of hole regions softens and complies the substrate structure before grinding contact. This pre-preparation significantly reduces the mechanical stress and abrasion on the grinding wheel during thickness adjustment, thereby extending tool lifespan and reducing equipment wear while maintaining precise thickness control.
4Manufacturing precision
If conventional grinding is applied to difficult-to-grind materials, then substrate thickness can be adjusted, but processing costs increase
Solution Approach 1:
By performing the hole formation step before grinding, the method enables subsequent grinding to be completed faster, with fewer tool changes, and with less waste. Although an additional step is added, the overall process efficiency improves, reducing downtime and tool replacement costs, thereby lowering total processing costs while maintaining precise thickness control.
5Productivity
If pulsed laser beam is applied to form hole regions, then grinding stability and speed improve, but process complexity increases
Solution Approach 1:
The method replaces the mechanical grinding action with a preliminary laser-based modification step. The pulsed laser beam creates hole regions that prepare the substrate for subsequent gentle grinding, substituting high-stress mechanical interaction with a more controlled, less invasive process that improves grinding stability and speed despite adding process steps.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances the stability and speed of the grinding process, extends tool lifespan, and reduces processing costs by making it possible to accurately control substrate thickness and prevent damage to the substrate and tools.
Implementation Method 1
applying a pulsed laser beam to the substrate from the side of the second surface, in a plurality of positions along the second surface, so as to form a plurality of hole regions in the substrate
Implementation Method 2
grinding the second surface of the substrate, where the plurality of hole regions has been formed, to adjust the substrate thickness
Data Source
AI summary
The invention relates to a method of processing a substrate, having a first surface with a device area and a second surface opposite the first surface, wherein the device area has a plurality of devices formed therein. The method comprises applying a pulsed laser beam to the substrate from the side of the second surface, in a plurality of positions along the second surface, so as to form a plurality of hole regions in the substrate, each hole region extending from the second surface towards the first surface. Each hole region is composed of a modified region and a space in the modified region open to the second surface. The method further comprises grinding the second surface of the substrate, where the plurality of hole regions has been formed, to adjust the substrate thickness.