Substrate-Based LED Components Batch Processing
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Solution Overview
Problem
Conventional light emitter devices and components are individually processed, leading to high costs, inefficiencies, and inconsistent color targeting due to the need for custom fabrication and encapsulation of LED chips, which limits their adoption and scalability in lighting applications.
Innovation Solution
The development of substrate-based light emitter devices and components that allow for batch processing, including die attachment, wirebonding, and encapsulation of multiple LED chips simultaneously, enabling consistent color targeting and reduced production time and costs through the use of a shared encapsulant and customizable reflective materials.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If individual LED chips are individually mounted, encapsulated, and processed, then each device can be customized, but production costs increase and processing time extends
Solution Approach 1:
The patent segments the production process into two distinct phases: batch processing phase where multiple LED chips are simultaneously mounted, wirebonded, and encapsulated on a shared substrate, followed by a singulation phase where individual devices are separated. This segmentation enables both high-volume efficient production and subsequent customization of individual devices.
Solution Approach 2:
The patent performs preliminary batch processing actions (mounting, wirebonding, encapsulation) on multiple LED chips simultaneously before final device separation. By completing these operations in advance on a shared substrate, the system achieves economies of scale while preserving the ability to customize individual devices later through selective modification during or after singulation.
2Manufacturing precision
If individual encapsulation is performed for each LED chip, then precise control is achieved, but processing time increases and phosphors settle causing inconsistent color
Solution Approach 1:
The patent merges the encapsulation process for multiple LED chips into a single simultaneous operation. A shared encapsulant is applied over the entire array of LED chips on the substrate in one continuous action, eliminating the time delays and phosphor settling issues associated with sequential individual encapsulation while maintaining consistent color targeting across all devices.
Solution Approach 2:
The patent implements continuous encapsulation flow where the encapsulant is applied uniformly across all LED chips without interruption or停顿. This continuous action prevents phosphor settling between encapsulation steps and ensures consistent optical properties, while the entire batch is processed in one continuous operation rather than sequentially.
3Reliability
If custom fabricated packages are used for each device, then device performance is optimized, but manufacturing cost increases
Solution Approach 1:
The patent creates a universal substrate structure and shared encapsulant system that serves multiple LED chips simultaneously. This universal platform provides consistent performance characteristics across all devices while eliminating the need for expensive custom fabrication for each individual device. The shared substrate and encapsulant approach maintains device reliability through standardized, optimized design elements.
Solution Approach 2:
The patent uses a standardized substrate and shared encapsulant design that can be replicated across multiple devices in a batch. Instead of creating unique custom packages for each device, the system copies the optimized substrate and encapsulation structure across the entire array, achieving consistent performance at lower manufacturing cost through economies of scale.
Data Source
AI summary
Substrate based light emitter devices, components, and related methods are disclosed. In some aspects, light emitter components can include a substrate and a plurality of light emitter devices provided over the substrate. Each device can include a surface mount device (SMD) adapted to mount over an external substrate or heat sink. In some aspects, each device of the plurality of devices can include at least one LED chip electrically connected to one or more traces and at least one pair of bottom contacts adapted to mount over a surface of external substrate. The component can further include a continuous layer of encapsulant disposed over each device of the plurality of devices. Multiple devices can be singulated from the component.