Substrate-Less Flip-Chip LED Package for Uniform White Light

The patent extracts the substrate from the LED chip structure, creating a substrate-less LED chip that is then bonded to a submount. This extraction eliminates the need for conformal sidewall phosphor coating, allowing instead for a planar phosphor coating on the chip top surface, which achieves uniform phosphor thickness and excellent color uniformity while maintaining high light capture efficiency through the optimized chip-submount configuration.

The patent moves the phosphor coating from a vertical sidewall configuration to a horizontal planar configuration on the chip top surface. This dimensional change allows the phosphor to be positioned close to the light source for efficient light capture while the heat can dissipate laterally through the chip and submount structure, preventing heat-induced degradation of the phosphor host material.

The patent extracts the substrate at the wafer level before die bonding, creating substrate-less LED chips that are directly bonded to the submount. This extraction approach eliminates the substrate lift-off process entirely, avoiding epitaxial layer cracking and achieving high manufacturing yield while maintaining high productivity through efficient wafer-level processing.

The patent merges multiple LED chips and the submount into a single integrated package structure at the wafer level. Multiple substrate-less LED chips are bonded in close proximity to a common submount with integrated phosphor coating, creating a unified white LED package that achieves high light output while minimizing device complexity through consolidated manufacturing and compact design.